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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
AGFB019R24C2E2V
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 65,605.63 AED | Dhs. 65,605.63 AED |
| 15+ | Dhs. 63,533.88 AED | Dhs. 953,008.20 AED |
| 25+ | Dhs. 62,152.70 AED | Dhs. 1,553,817.50 AED |
| 50+ | Dhs. 58,699.78 AED | Dhs. 2,934,989.00 AED |
| 100+ | Dhs. 51,793.92 AED | Dhs. 5,179,392.00 AED |
| N+ | Dhs. 10,358.78 AED | Price Inquiry |
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Intel Altera Agilex F AGFB019R24C2E2V FPGA System-on-Chip
The AGFB019R24C2E2V from Intel's Altera Agilex F series represents cutting-edge FPGA SoC technology, combining high-performance processing with massive programmable logic capacity. This industrial-grade device delivers exceptional computational power for demanding applications in aerospace, automotive, communications, and edge computing.
Key Features & Benefits
- Massive Logic Capacity: 1.9 million logic elements provide extensive programmable resources for complex designs
- High-Performance Processing: Quad ARM Cortex-A53 MPCore with NEON and floating-point acceleration running at 1.4GHz
- Advanced Debugging: Integrated CoreSight technology for comprehensive system visibility
- Rich Connectivity: Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, and EBI/EMI interfaces
- Industrial Temperature Range: Operates reliably from 0°C to 100°C (junction temperature)
- Compact High-Density Package: 2340-pin BGA (45x42mm) with exposed pad for enhanced thermal performance
Ideal Applications
This FPGA SoC excels in applications requiring both high-speed processing and flexible hardware acceleration, including industrial automation, advanced driver assistance systems (ADAS), 5G infrastructure, machine vision, and real-time signal processing.
Authentic Intel Altera product with full manufacturer warranty and traceability documentation. Suitable for professional engineering and production applications.
| Product attributes | Property Value |
| Manufacturer | Altera |
| Product Series | Agilex F |
| Packaging | Tray | Tray |
| Architecture | MPU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 1.4GHz |
| Primary Attributes | FPGA - 1.9M Logic Elements |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 2340-BFBGA Exposed Pad |
| Supplier Device Package | 2340-BGA (45x42) |
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
