Altera AGFB019R24C2I3V

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Altera AGFB019R24C2I3V - Agilex F Series FPGA SoC

The AGFB019R24C2I3V from Altera represents a high-performance System-on-Chip (SoC) solution combining FPGA flexibility with embedded processing power. This Agilex F series device integrates a Quad ARM® Cortex®-A53 MPCore™ processor running at 1.4GHz with a massive 1.9M logic element FPGA fabric, making it ideal for demanding applications in aerospace, automotive, industrial automation, telecommunications, and medical equipment.

Key Features & Benefits

  • Powerful Processing: Quad ARM Cortex-A53 cores with NEON and floating-point support deliver exceptional computational performance
  • Massive FPGA Resources: 1.9M logic elements provide extensive programmable logic for custom acceleration and signal processing
  • Rich Connectivity: Integrated Ethernet, USB OTG, SPI, I2C, UART/USART, MMC/SD/SDIO, and EBI/EMI interfaces
  • Industrial Grade: Operating temperature range of -40°C to 100°C (TJ) ensures reliability in harsh environments
  • Advanced Peripherals: DMA and watchdog timer support for robust system design
  • Compact Integration: 2340-BGA (45x42mm) package with exposed pad for optimal thermal management

Applications

This SoC is engineered for applications requiring both high-performance processing and flexible hardware acceleration, including 5G wireless infrastructure, advanced driver assistance systems (ADAS), industrial machine vision, medical imaging equipment, and high-speed data acquisition systems.

Quality & Compliance

All units are sourced through authorized distribution channels with full traceability. RoHS and REACH compliant. Long lifecycle commitment ensures availability for design-in applications requiring extended product support.

Product attributes Property Value
Manufacturer Altera
Product Series Agilex F
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.4GHz
Primary Attributes FPGA - 1.9M Logic Elements
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2340-BFBGA Exposed Pad
Supplier Device Package 2340-BGA (45x42)

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.