Altera AGFB022R31C2E2VB

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Regular price Dhs. 93,145.27
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Altera AGFB022R31C2E2VB - High-Performance Agilex F FPGA System-on-Chip

The AGFB022R31C2E2VB from Altera represents cutting-edge FPGA technology, combining a powerful Quad ARM® Cortex®-A53 MPCore™ processor with 2.2 million logic elements in a single System-on-Chip (SoC) solution. This active-status device delivers exceptional performance for demanding aerospace, automotive, industrial, telecommunications, and medical applications.

Key Features & Benefits

  • Powerful Processing: Quad ARM Cortex-A53 MPCore with CoreSight, ARM NEON, and floating-point capabilities running at 1.4GHz
  • Massive Logic Capacity: 2.2M logic elements provide extensive programmable resources for complex designs
  • Comprehensive Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG interfaces
  • Industrial Temperature Range: Operates reliably from 0°C to 100°C (TJ)
  • Advanced Peripherals: Integrated DMA and WDT for enhanced system performance
  • Compact BGA Package: 3184-BFBGA (56x45) with exposed pad for superior thermal management

Ideal Applications

Perfect for high-reliability applications requiring long lifecycle support including aerospace systems, automotive electronics, industrial automation, telecommunications infrastructure, and medical devices. The combination of hard processor system and FPGA fabric enables flexible, high-performance embedded solutions.

Authorized Distributor: We provide full traceability, long lifecycle support, and design-in resources for all Altera semiconductor components. Contact us for volume pricing, technical documentation, and application support.

Product attributes Property Value
Manufacturer Altera
Product Series Agilex F
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.4GHz
Primary Attributes FPGA - 2.2M Logic Elements
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 3184-BFBGA Exposed Pad
Supplier Device Package 3184-BGA (56x45)

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