Altera AGFB023R31C2E3V

Skip to product information
1 of 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Regular price Dhs. 74,545.70
Regular price Dhs. 78,469.15 Sale price Dhs. 74,545.70
Sale Sold out
Quantity Unit Price Total Price
1 Dhs. 74,545.70 Dhs. 74,545.70
15+ Dhs. 72,191.62 Dhs. 1,082,874.30
25+ Dhs. 70,622.24 Dhs. 1,765,556.00
50+ Dhs. 66,698.78 Dhs. 3,334,939.00
100+ Dhs. 58,851.86 Dhs. 5,885,186.00
N+ Dhs. 11,770.37 Price Inquiry
Shipping calculated at checkout.
Quantity
Component Recycling

Request Quote / Inquiry

Altera AGFB023R31C2E3V - Agilex F Series FPGA System-on-Chip

The AGFB023R31C2E3V from Altera represents a cutting-edge FPGA solution in the Agilex F series, combining a powerful Quad ARM® Cortex®-A53 MPCore™ processor with 2.3 million logic elements. This advanced System-on-Chip (SoC) delivers exceptional processing capabilities at 1.4GHz with integrated CoreSight™, ARM NEON, and floating-point support, making it the ideal choice for demanding applications across aerospace, automotive, industrial automation, telecommunications, and medical equipment sectors.

Key Features & Technical Advantages

  • High-Density FPGA Architecture: 2.3M logic elements provide extensive programmable logic resources for complex, scalable designs
  • Powerful Multi-Core Processing: Quad ARM Cortex-A53 cores running at 1.4GHz with 256KB RAM for intensive computational workloads
  • Comprehensive Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG interfaces enable seamless system integration
  • Industrial Temperature Range: 0°C to 100°C (TJ) ensures reliable operation in harsh environmental conditions
  • Advanced Peripheral Support: DMA and WDT capabilities for efficient system management and monitoring
  • Optimized Thermal Design: 3184-BFBGA (56x45mm) package with exposed pad for superior heat dissipation
  • Enhanced Processing Features: CoreSight debug, ARM NEON SIMD, and hardware floating-point acceleration

Target Applications

This Agilex F FPGA SoC is specifically engineered for high-performance embedded systems requiring both programmable logic flexibility and robust processor capabilities:

  • 5G Infrastructure: Base stations, radio units, and network acceleration
  • Edge Computing: AI inference, real-time analytics, and distributed processing
  • Industrial IoT: Smart manufacturing, predictive maintenance, and automation control
  • Automotive ADAS: Advanced driver assistance systems, sensor fusion, and autonomous driving
  • Medical Imaging: Ultrasound, CT/MRI processing, and diagnostic equipment
  • Aerospace & Defense: Radar systems, secure communications, and mission-critical applications
  • Telecommunications: Network processors, protocol conversion, and signal processing

Quality Assurance & Compliance

Active production status with full manufacturer traceability and authentic component guarantee. RoHS and REACH compliant for global environmental standards. Complete supply chain documentation and lifecycle support available. Backed by our commitment to delivering only genuine, traceable semiconductor components with comprehensive technical support.

Why Choose AGFB023R31C2E3V?

The Agilex F series represents Altera's latest generation FPGA technology, offering superior performance-per-watt, advanced security features, and unmatched design flexibility. The combination of high-density programmable logic with quad-core ARM processing creates a versatile platform that accelerates time-to-market while reducing overall system complexity and cost.

Technical Support & Documentation

Complete datasheets, application notes, reference designs, and technical documentation available. Our engineering team provides expert support for design-in, integration, and lifecycle management to ensure your project success.

Product attributes Property Value
Manufacturer Altera
Product Series Agilex F
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.4GHz
Primary Attributes FPGA - 2.3M Logic Elements
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 3184-BFBGA Exposed Pad
Supplier Device Package 3184-BGA (56x45)

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.