Altera AGFB023R31C2E4X

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Intel Altera Agilex F Series FPGA - AGFB023R31C2E4X

The AGFB023R31C2E4X is a high-performance System-on-Chip (SoC) FPGA from Intel's Altera Agilex F series, combining 2.3 million logic elements with a powerful Quad ARM® Cortex®-A53 MPCore™ processor running at 1.4GHz. This advanced device integrates ARM NEON technology, floating-point processing, and CoreSight™ debug capabilities, making it ideal for demanding applications in aerospace, automotive, industrial automation, and telecommunications.

Key Features & Benefits

  • Massive Logic Capacity: 2.3M logic elements provide exceptional flexibility for complex FPGA designs and custom logic implementation
  • High-Performance Processing: Quad ARM Cortex-A53 MPCore at 1.4GHz delivers robust embedded processing power with NEON SIMD acceleration
  • Rich Connectivity: Comprehensive peripheral support including Ethernet, USB OTG, MMC/SD/SDIO, SPI, I2C, UART/USART, and EBI/EMI interfaces
  • Industrial-Grade Reliability: Operating temperature range of 0°C to 100°C (TJ) ensures reliable performance in harsh environments
  • Advanced Integration: 256KB on-chip RAM, DMA controller, and watchdog timer for efficient system design
  • Compact High-Density Package: 3184-BFBGA (56x45mm) with exposed pad for superior thermal management

Target Applications

This Agilex F SoC FPGA is engineered for mission-critical applications requiring both high-performance processing and flexible programmable logic, including 5G wireless infrastructure, advanced driver assistance systems (ADAS), industrial machine vision, aerospace avionics, high-speed networking equipment, and edge AI acceleration.

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Product attributes Property Value
Manufacturer Altera
Product Series Agilex F
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.4GHz
Primary Attributes FPGA - 2.3M Logic Elements
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 3184-BFBGA Exposed Pad
Supplier Device Package 3184-BGA (56x45)

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