Altera AGFB027R24C2I2VB

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Altera AGFB027R24C2I2VB - Agilex F Series SoC FPGA

The AGFB027R24C2I2VB is a high-performance System-on-Chip (SoC) FPGA from Intel's Altera Agilex F series, combining a powerful Quad ARM® Cortex®-A53 MPCore™ processor with 2.7 million logic elements. Designed for demanding applications in aerospace, automotive, industrial automation, and telecommunications, this device delivers exceptional processing power at 1.4GHz with advanced connectivity options.

Key Features & Benefits

  • High-Density FPGA: 2.7M logic elements for complex design implementation
  • Powerful Processing: Quad ARM Cortex-A53 MPCore with CoreSight, NEON, and floating-point support running at 1.4GHz
  • Comprehensive Connectivity: Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, EBI/EMI interfaces
  • Industrial-Grade Reliability: Operating temperature range -40°C to 100°C (TJ)
  • Advanced Peripherals: DMA and WDT for enhanced system control
  • Compact BGA Package: 2340-BFBGA (45x42mm) with exposed pad for superior thermal performance

Ideal Applications

Perfect for aerospace flight control systems, automotive ADAS and infotainment, industrial automation controllers, 5G telecommunications infrastructure, high-performance computing, and embedded vision systems requiring both FPGA flexibility and ARM processing power.

Authorized Distribution & Support

We provide authorized distributor stock with full manufacturer documentation, traceability certificates, and long lifecycle availability. Our technical team offers design-in support, reference designs, and application guidance to accelerate your development cycle and mitigate obsolescence risk.

Product attributes Property Value
Manufacturer Altera
Product Series Agilex F
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.4GHz
Primary Attributes FPGA - 2.7M Logic Elements
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2340-BFBGA Exposed Pad
Supplier Device Package 2340-BGA (45x42)

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.