Altera AGFC023R24C2E2V

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Altera AGFC023R24C2E2V - Agilex F Series FPGA System-on-Chip

The AGFC023R24C2E2V from Altera represents a premium FPGA System-on-Chip solution combining high-performance processing with extensive programmable logic resources. This device integrates a Quad ARM® Cortex®-A53 MPCore™ processor running at 1.4GHz with a massive 2.3M logic element FPGA fabric, delivering exceptional flexibility for aerospace, automotive, industrial, telecommunications, and medical applications.

Key Features & Benefits

  • High-Performance Processing: Quad ARM Cortex-A53 MPCore with CoreSight, ARM NEON, and floating-point support at 1.4GHz
  • Massive FPGA Resources: 2.3 million logic elements for complex custom logic implementation
  • Comprehensive Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG interfaces
  • Industrial-Grade Reliability: Operating temperature range 0°C to 100°C (TJ), active production status
  • Advanced Peripherals: DMA and WDT support for efficient system operation
  • Compact High-Density Package: 2340-BGA (45x42mm) with exposed pad for enhanced thermal performance

Applications & Use Cases

Ideal for demanding embedded applications requiring both high-performance processing and extensive custom logic capabilities, including advanced driver assistance systems (ADAS), industrial automation controllers, telecommunications infrastructure, medical imaging equipment, and aerospace/defense systems.

Quality & Traceability

All units are sourced through authorized distribution channels with full manufacturer traceability and compliance documentation (RoHS/REACH). Active production status ensures long-term availability and lifecycle support for critical design-ins.

Product attributes Property Value
Manufacturer Altera
Product Series Agilex F
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.4GHz
Primary Attributes FPGA - 2.3M Logic Elements
Operating Temperature 0°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2340-BFBGA Exposed Pad
Supplier Device Package 2340-BGA (45x42)

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.