Altera AGFD019R24C2I2VB

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Altera AGFD019R24C2I2VB - High-Performance Agilex F FPGA System-on-Chip

The Altera AGFD019R24C2I2VB is a premium System-on-Chip (SoC) combining FPGA flexibility with embedded processing power, engineered for mission-critical applications in aerospace, automotive, industrial automation, telecommunications, and medical systems.

Key Features & Benefits

  • Massive Logic Capacity: 1.9 million logic elements deliver exceptional programmable logic resources for complex designs
  • Powerful Embedded Processing: Quad ARM Cortex-A53 MPCore with CoreSight, ARM NEON, and floating-point acceleration running at 1.4GHz
  • Industrial-Grade Reliability: Extended operating temperature range (-40°C to 100°C TJ) ensures reliable operation in harsh environments
  • Rich Connectivity: Comprehensive peripheral support including Ethernet, USB OTG, MMC/SD/SDIO, SPI, I2C, UART/USART, and EBI/EMI interfaces
  • Active Production Status: Current Altera Agilex F series product with long lifecycle support and full traceability

Ideal Applications

This SoC excels in demanding applications requiring both high-performance processing and flexible FPGA logic, including 5G/6G wireless infrastructure, advanced driver assistance systems (ADAS), industrial machine vision, medical imaging equipment, and aerospace/defense systems.

Why Choose This Component?

Backed by Altera's industry-leading FPGA technology and comprehensive development tools, the AGFD019R24C2I2VB offers the perfect balance of processing power, programmable logic, and connectivity for next-generation embedded systems. Full RoHS/REACH compliance ensures global regulatory conformance.

Product attributes Property Value
Manufacturer Altera
Product Series Agilex F
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.4GHz
Primary Attributes FPGA - 1.9M Logic Elements
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2340-BFBGA Exposed Pad
Supplier Device Package 2340-BGA (45x42)

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