Altera AGFD023R24C3I3E

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Altera AGFD023R24C3I3E - Agilex F Series FPGA with Integrated ARM Cortex-A53 Processor

The AGFD023R24C3I3E from Altera represents a high-performance System-on-Chip (SoC) solution combining FPGA flexibility with embedded processing power. This Agilex F series device integrates 2.3 million logic elements with a Quad ARM® Cortex®-A53 MPCore™ processor running at 1.4GHz, delivering exceptional computational capability for demanding applications in aerospace, automotive, telecommunications, and industrial control systems.

Key Features & Benefits

  • Massive Logic Capacity: 2.3M logic elements provide extensive programmable resources for complex digital designs
  • Integrated Processing: Quad ARM Cortex-A53 MPCore with CoreSight, NEON, and floating-point acceleration
  • High-Speed Performance: 1.4GHz processor speed with 256KB on-chip RAM
  • Rich Connectivity: Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, EBI/EMI interfaces
  • Industrial-Grade Reliability: -40°C to 100°C junction temperature range for harsh environments
  • Advanced Packaging: 2340-BGA (45x42mm) with exposed pad for superior thermal management

Ideal Applications

This SoC FPGA is engineered for applications requiring both high-performance processing and flexible hardware acceleration, including 5G wireless infrastructure, advanced driver assistance systems (ADAS), industrial automation, medical imaging, aerospace avionics, and high-frequency trading platforms.

Authentic Altera Quality

We supply genuine Altera components with full manufacturer documentation, traceability, and long lifecycle support. Each device is sourced from authorized distributors and ships in factory-sealed tray packaging to ensure authenticity and reliability for your critical designs.

Product attributes Property Value
Manufacturer Altera
Product Series Agilex F
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.4GHz
Primary Attributes FPGA - 2.3M Logic Elements
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 2340-BFBGA Exposed Pad
Supplier Device Package 2340-BGA (45x42)

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.