AGIB027R31A2I2V

Altera Agilex I Series FPGA System-on-Chip - AGIB027R31A2I2V

The AGIB027R31A2I2V represents the pinnacle of FPGA System-on-Chip technology from Altera's Agilex I series. This advanced device seamlessly integrates high-performance ARM processing with massive programmable logic resources, delivering unparalleled computational power and flexibility for mission-critical applications across aerospace, automotive, telecommunications, industrial automation, and medical device sectors.

Core Processing Power

At the heart of this SoC lies a Quad ARM® Cortex®-A53 MPCore™ processor running at 1.4GHz, enhanced with CoreSight™ debug and trace technology, ARM NEON SIMD engine, and hardware floating-point unit. This combination delivers exceptional performance for complex signal processing, real-time control algorithms, and data-intensive applications while maintaining power efficiency.

Massive Programmable Logic Resources

With 2.7 million logic elements, the AGIB027R31A2I2V provides extensive programmable fabric for implementing custom hardware accelerators, complex digital signal processing pipelines, high-speed interfaces, and application-specific logic. The integrated 256KB RAM ensures efficient data buffering and processing without external memory bottlenecks.

Comprehensive Connectivity & Peripherals

• Ethernet: High-speed networking for industrial IoT and communications infrastructure
• USB OTG: Flexible host/device connectivity for data transfer and peripheral support
• Serial Interfaces: Multiple SPI, I²C, and UART/USART channels for sensor integration and communication
• Memory Card Support: MMC/SD/SDIO interfaces for expandable storage and data logging
• DMA & Watchdog Timer: Efficient data movement and system reliability features
• EBI/EMI: External bus interface for memory expansion and custom peripherals

Industrial-Grade Reliability

Engineered for demanding environments, this device operates reliably across an extended temperature range of -40°C to +100°C (TJ), making it ideal for automotive under-hood applications, industrial control systems, outdoor telecommunications equipment, and aerospace avionics where temperature extremes are common.

Advanced Packaging Technology

The 3184-BFBGA (56x45mm) package with exposed thermal pad provides superior heat dissipation, enabling sustained high-performance operation while maintaining thermal stability. This advanced packaging supports high-density PCB layouts and reliable solder joint integrity for long-term field deployment.

Target Applications

• Aerospace & Defense: Radar processing, avionics control, secure communications
• Automotive: ADAS systems, autonomous driving compute platforms, vehicle networking
• Telecommunications: 5G infrastructure, baseband processing, network acceleration
• Industrial Automation: Machine vision, motion control, predictive maintenance systems
• Medical Devices: Imaging systems, diagnostic equipment, patient monitoring
• Test & Measurement: High-speed data acquisition, signal analysis, protocol testing

Why Choose AGIB027R31A2I2V?

• ✓ Active Production Status: Long-term availability and lifecycle support
• ✓ Authorized Distribution: Genuine components with full traceability
• ✓ Design-In Support: Technical resources and reference designs available
• ✓ Scalable Architecture: Migrate across Agilex family as requirements evolve
• ✓ Industry Standards: Compliant with automotive, aerospace, and industrial certifications

Ordering Information

Part Number: AGIB027R31A2I2V
Availability: Active - In Stock
Packaging: Tray
Lead Time: Contact for current availability
Documentation: Datasheet, reference manuals, and design guides available upon request

As an authorized distributor, we provide genuine Altera components with full manufacturer warranty, technical support, and complete supply chain traceability for your critical applications.

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.