Altera AGID019R18A1I1VB

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Intel Altera AGID019R18A1I1VB - Agilex I FPGA SoC

The AGID019R18A1I1VB is a high-performance FPGA System-on-Chip (SoC) from Intel's Agilex I series, combining 1.9 million logic elements with a powerful Quad ARM® Cortex®-A53 MPCore™ processor running at 1.4GHz. This advanced device is engineered for demanding applications in aerospace, automotive, telecommunications, and industrial markets requiring exceptional processing power and flexibility.

Key Features

  • 1.9M Logic Elements - Massive FPGA fabric for complex designs
  • Quad ARM Cortex-A53 MPCore with CoreSight™, ARM NEON, and floating-point support
  • 1.4GHz Processing Speed - High-performance embedded processing
  • 256KB RAM integrated on-chip
  • Rich Connectivity - Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, EBI/EMI
  • Industrial Temperature Range - Operates from -40°C to 100°C (TJ)
  • 1805-BBGA Package (42.5mm x 42.5mm) with exposed pad for enhanced thermal performance

Applications

Ideal for advanced embedded systems requiring high-density FPGA resources combined with ARM processing capabilities, including 5G infrastructure, industrial automation, aerospace systems, automotive ADAS, and high-performance computing applications.

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Product attributes Property Value
Manufacturer Altera
Product Series Agilex I
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.4GHz
Primary Attributes FPGA - 1.9M Logic Elements
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1805-BBGA Exposed Pad
Supplier Device Package 1805-BGA (42.5x42.5)

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.