Altera AGID023R18A2I1V

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Intel Altera AGID023R18A2I1V - Agilex I Series FPGA SoC

The AGID023R18A2I1V is a high-performance FPGA System-on-Chip (SoC) from Intel's Altera Agilex I series, combining advanced FPGA fabric with embedded ARM processing for demanding aerospace, automotive, industrial, and telecommunications applications.

Key Features

  • Quad ARM Cortex-A53 MPCore with CoreSight, ARM NEON, and floating-point acceleration running at 1.4GHz
  • 2.3 million logic elements for complex FPGA designs and parallel processing
  • 256KB integrated RAM for embedded system operations
  • Rich connectivity: Ethernet, USB OTG, I2C, SPI, UART/USART, MMC/SD/SDIO, EBI/EMI
  • Industrial temperature range: -40°C to +100°C (TJ) for harsh environments
  • 1805-BBGA package (42.5mm × 42.5mm) with exposed pad for thermal management

Applications

Ideal for high-performance embedded systems requiring FPGA acceleration, including 5G/telecommunications infrastructure, industrial automation and control, automotive ADAS and infotainment systems, aerospace and defense systems, edge computing and AI inference, and high-speed data acquisition.

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We supply genuine Intel Altera components with complete manufacturer documentation, traceability, and warranty support. All units are sourced through authorized channels with long lifecycle availability to support your critical programs.

Product attributes Property Value
Manufacturer Altera
Product Series Agilex I
Packaging Tray |
Part Status Active
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1.4GHz
Primary Attributes FPGA - 2.3M Logic Elements
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1805-BBGA Exposed Pad
Supplier Device Package 1805-BGA (42.5x42.5)

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.