BCM4352ESP01
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 355,870.06 AED | Dhs. 355,870.06 AED |
| 15+ | Dhs. 344,632.06 AED | Dhs. 5,169,480.90 AED |
| 25+ | Dhs. 337,140.05 AED | Dhs. 8,428,501.25 AED |
| 50+ | Dhs. 318,410.05 AED | Dhs. 15,920,502.50 AED |
| 100+ | Dhs. 280,950.05 AED | Dhs. 28,095,005.00 AED |
| N+ | Dhs. 56,190.01 AED | Price Inquiry |
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Broadcom BCM4352ESP01 Wireless System-on-Chip
The BCM4352ESP01 is a high-performance wireless system-on-chip (SoC) from Broadcom Limited, combining the BCM43520KMLG and BCM43217 chipsets. This advanced IC delivers robust wireless connectivity for demanding industrial, automotive, aerospace, and communications applications.
Key Features
- Integrated BCM43520KMLG + BCM43217 architecture
- Professional-grade wireless connectivity solution
- Tray packaging for volume manufacturing
- Manufactured by Broadcom Limited - trusted semiconductor leader
- Suitable for industrial, automotive, aerospace, and edge computing deployments
Applications
Ideal for high-reliability wireless systems in industrial automation, automotive infotainment, aerospace communications, edge computing nodes, and professional networking equipment.
Authenticity Guarantee
All BCM4352ESP01 units are sourced directly from authorized Broadcom channels, ensuring full traceability, authenticity, and compliance with original specifications. Each shipment includes proper documentation and packaging integrity verification.
| Product attributes | Property Value |
| Manufacturer | Broadcom Limited |
| Product Series | |
| Packaging | | Tray |
| Architecture | - |
| Core Processor | - |
| Flash Size | - |
| RAM Size | - |
| Peripherals | - |
| Connectivity | - |
| Speed | - |
| Primary Attributes | - |
| Operating Temperature | - |
| Grade | - |
| Qualification | - |
| Package / Case | - |
| Supplier Device Package | - |
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
