BCM55045B1IFSBG
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 282.88 AED | Dhs. 282.88 AED |
| 15+ | Dhs. 273.93 AED | Dhs. 4,108.95 AED |
| 25+ | Dhs. 267.98 AED | Dhs. 6,699.50 AED |
| 50+ | Dhs. 253.09 AED | Dhs. 12,654.50 AED |
| 100+ | Dhs. 223.31 AED | Dhs. 22,331.00 AED |
| N+ | Dhs. 44.66 AED | Price Inquiry |
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Broadcom BCM55045B1IFSBG - 10G XPON DPU System-on-Chip
The BCM55045B1IFSBG from Broadcom Limited is a high-performance System-on-Chip (SOC) designed for 10G XPON (10-Gigabit-capable Passive Optical Network) applications with integrated DPU (Data Path Unit) functionality. This advanced semiconductor component delivers exceptional performance for next-generation fiber optic network infrastructure, enabling high-speed broadband connectivity for telecommunications and enterprise applications.
Key Features & Benefits
- High-Speed Connectivity: Optimized for 10G XPON networks, supporting ultra-fast data transmission rates
- Integrated DPU Architecture: Built-in data path processing for efficient packet handling and network management
- Active Production Status: Currently in active production with long lifecycle availability
- Tray Packaging: Bulk packaging option ideal for high-volume manufacturing and production environments
- Broadcom Quality: Manufactured by Broadcom Limited, a global leader in semiconductor and infrastructure software solutions
- Full Traceability: Complete documentation and compliance support for mission-critical applications
Applications
- Fiber-to-the-Home (FTTH) and Fiber-to-the-Premises (FTTP) deployments
- Telecommunications infrastructure equipment
- Optical Line Terminal (OLT) systems
- High-speed broadband access networks
- Enterprise fiber optic connectivity solutions
Why Choose Us as Your Distributor
As an authorized distributor, we provide genuine Broadcom components with complete traceability, compliance documentation (RoHS/REACH), and technical support. Our inventory management ensures reliable availability for your production schedules, with flexible packaging options and global shipping capabilities.
Part Number: BCM55045B1IFSBG
Manufacturer: Broadcom Limited
Product Type: IC SOC 10G XPON DPU CHIP
Status: Active Production
| Product attributes | Property Value |
| Manufacturer | Broadcom Limited |
| Product Series | |
| Packaging | Tray | |
| Part Status | Active |
| Architecture | - |
| Core Processor | - |
| Flash Size | - |
| RAM Size | - |
| Peripherals | - |
| Connectivity | - |
| Speed | - |
| Primary Attributes | - |
| Operating Temperature | - |
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| Qualification | - |
| Package / Case | - |
| Supplier Device Package | - |
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
