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Product attributes Property Value
Manufacturer Microsemi Corporation
Product Series EX
Packaging Tray | Tray
Number of LABs/CLBs -
Number of Logic Elements/Cells 128
Total RAM Bits -
Number of I/O 56
Number of Gates 3000
Voltage - Supply 2.3V ~ 2.7V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 70°C (TA)
Grade -
Qualification -
Package / Case 100-LQFP
Supplier Device Package 100-TQFP (14x14)

Microsemi EX64-TQG100 FPGA - High-Performance Programmable Logic Device

The EX64-TQG100 from Microsemi Corporation delivers reliable FPGA performance for industrial, automotive, aerospace, and embedded computing applications. This compact 100-TQFP surface-mount device features 128 logic elements and 56 I/O pins, providing flexible programmable logic capabilities in a space-efficient footprint.

Key Features & Benefits

  • 128 Logic Elements - Flexible programmable logic for custom digital circuit implementation
  • 56 I/O Pins - Extensive connectivity for complex interface requirements
  • 3000 Gates - Sufficient logic density for mid-range FPGA applications
  • Surface Mount 100-TQFP Package - Compact 14x14mm footprint for high-density PCB layouts
  • Industrial Temperature Range - Reliable operation from 0°C to 70°C (TA)
  • Low Voltage Operation - 2.3V to 2.7V supply voltage for power-efficient designs

Typical Applications

  • Industrial automation and control systems
  • Automotive electronics and embedded controllers
  • Aerospace and communications equipment
  • Edge computing and IoT gateway devices
  • Custom digital signal processing
  • Protocol bridging and interface conversion

All products are sourced from authorized distributors and come with full manufacturer traceability and authenticity documentation.

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.