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Regular price Dhs. 17.98
Regular price Dhs. 18.92 Sale price Dhs. 17.98
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Product attributes Property Value
Manufacturer ISSI, Integrated Silicon Solution Inc
Product Series
Packaging Tape & Reel (TR) | Tape & Reel (TR)
Memory Type Volatile
Memory Format DRAM
Technology SDRAM
Memory Size 256Mbit
Memory Organization 8M x 32
Memory Interface Parallel
Clock Frequency 133 MHz
Write Cycle Time - Word, Page -
Access Time 6 ns
Voltage - Supply 3V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 86-TFSOP (0.400", 10.16mm Width)
Supplier Device Package 86-TSOP II
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

IS42S32800J-75ETLI-TR - 256Mbit Synchronous DRAM

The IS42S32800J-75ETLI-TR from ISSI (Integrated Silicon Solution Inc) is a high-performance 256Mbit synchronous DRAM designed for embedded systems requiring reliable, high-speed memory solutions. With an 8M x 32 organization and 133MHz clock frequency, this SDRAM delivers robust performance for industrial, automotive, and telecommunications applications.

Key Features:

  • Memory Capacity: 256Mbit (8M x 32 organization)
  • Speed: 133MHz clock frequency with 6ns access time
  • Interface: Parallel SDRAM interface for seamless integration
  • Operating Voltage: 3V to 3.6V for flexible power design
  • Temperature Range: -40°C to 85°C (extended industrial grade)
  • Package: 86-TSOP II surface mount package
  • RoHS Compliant: Environmentally friendly, lead-free solution

Applications:

Ideal for aerospace avionics, automotive infotainment systems, industrial controllers, networking equipment, and telecommunications infrastructure requiring long lifecycle availability and proven reliability.

Why Choose Authorized Distribution?

We provide 100% authentic ISSI components with full manufacturer documentation, traceability certificates, and warranty support. Our authorized distributor status ensures you receive genuine parts backed by ISSI's quality standards and long-term availability commitments.

Technical Specifications: