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Lattice LFE2M70SE-6FN1152I - High-Density ECP2M FPGA Solution

The LFE2M70SE-6FN1152I from Lattice Semiconductor represents a premium high-density FPGA solution from the proven ECP2M family, engineered for demanding aerospace, automotive, industrial, and telecommunications applications requiring exceptional logic capacity and I/O flexibility.

Key Features & Benefits

  • 67,000 Logic Elements - Extensive programmable logic resources for complex digital designs
  • 436 I/O Pins - Maximum connectivity for high-bandwidth interface requirements
  • 4.6 Megabits Embedded RAM - Substantial on-chip memory for data buffering and processing
  • Industrial Temperature Range - Reliable operation from -40°C to 100°C (TJ) for harsh environments
  • 1152-FBGA Package - Space-efficient 35x35mm footprint for high-density PCB layouts
  • RoHS Compliant - Meets environmental standards for global deployment

Applications

Ideal for high-performance embedded systems, communications infrastructure, industrial control, motor drive systems, video processing, and mission-critical aerospace/defense applications where reliability and long-term availability are paramount.

Quality & Authenticity Guarantee

Sourced from authorized distributors with full manufacturer documentation, traceability, and long lifecycle support. Each unit ships with complete datasheets and compliance certificates.

Product attributes Property Value
Manufacturer Lattice Semiconductor Corporation
Product Series ECP2M
Packaging Tray | Tray
Number of LABs/CLBs 8375
Number of Logic Elements/Cells 67000
Total RAM Bits 4642816
Number of I/O 436
Number of Gates -
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 1152-BBGA
Supplier Device Package 1152-FPBGA (35x35)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY