Lattice Semiconductor Corporation LFXP2-17E-6F484I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | $94,999.99 | $94,999.99 |
| 15+ | $91,999.99 | $1,379,999.85 |
| 25+ | $89,999.99 | $2,249,999.75 |
| 50+ | $84,999.99 | $4,249,999.50 |
| 100+ | $74,999.99 | $7,499,999.00 |
| N+ | $15,000.00 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | Lattice Semiconductor Corporation |
| Product Series | XP2 |
| Packaging | | Tray |
| Number of LABs/CLBs | 2125 |
| Number of Logic Elements/Cells | 17000 |
| Total RAM Bits | 282624 |
| Number of I/O | 358 |
| Number of Gates | - |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 484-BBGA |
| Supplier Device Package | 484-FPBGA (23x23) |
LFXP2-17E-6F484I Field Programmable Gate Array
The LFXP2-17E-6F484I is a high-performance Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation's XP2 series, engineered for demanding applications in aerospace, automotive, industrial control, medical devices, and telecommunications systems.
Key Features & Benefits
- 17,000 Logic Elements - Exceptional processing capacity for complex digital designs and signal processing applications
- 358 I/O Pins - Extensive connectivity options for interfacing with multiple peripheral devices and systems
- 282,624 Total RAM Bits - Substantial on-chip memory for data buffering and high-speed processing
- 2,125 LABs/CLBs - Flexible logic architecture for versatile design implementation
- Industrial Temperature Range - Reliable operation from -40°C to 100°C (TJ) for harsh environments
- Low Power Supply - Efficient 1.14V ~ 1.26V operation reduces power consumption
Applications
This FPGA is ideal for:
- High-speed data acquisition and processing systems
- Industrial automation and control systems
- Medical imaging and diagnostic equipment
- Telecommunications infrastructure
- Automotive electronics and ADAS systems
- Aerospace and defense applications
Package Information
The LFXP2-17E-6F484I comes in a compact 484-FPBGA (23x23mm) surface mount package, providing excellent thermal performance and high-density board integration for space-constrained designs.
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LFXP2-17E-6F484I.pdf