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Product attributes Property Value
Manufacturer Lattice Semiconductor Corporation
Product Series XP
Packaging | Tray
Number of LABs/CLBs -
Number of Logic Elements/Cells 6000
Total RAM Bits 73728
Number of I/O 188
Number of Gates -
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)

LFXP6E-3F256I - High-Performance FPGA Solution

The LFXP6E-3F256I from Lattice Semiconductor Corporation represents a cutting-edge solution in the XP Series of Field Programmable Gate Arrays. Engineered for demanding industrial applications, this FPGA delivers exceptional performance with 6000 logic elements and 188 I/O capabilities in a compact 256-FPBGA package.

Key Features & Benefits

  • High Logic Density: 6000 logic elements provide ample resources for complex digital designs
  • Extensive Memory: 73728 total RAM bits enable efficient data buffering and processing
  • Flexible I/O: 188 I/O pins support diverse interface requirements
  • Industrial Temperature Range: Operates reliably from -40°C to 100°C (TJ)
  • Low Power Design: 1.14V ~ 1.26V supply voltage optimizes power efficiency
  • Surface Mount Technology: 256-BGA package facilitates automated assembly

Ideal Applications

Perfect for aerospace systems, automotive electronics, industrial automation, medical devices, and telecommunications infrastructure where reliability and performance are critical.

Why Choose HQICKEY?

As a trusted distributor of high-reliability semiconductor components, HQICKEY ensures authentic products, competitive pricing, and expert technical support for your mission-critical applications.

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