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Product attributes Property Value
Manufacturer Power Integrations
Product Series LinkSwitch®-LP
Packaging |
Output Isolation Isolated
Internal Switch(s) Yes
Voltage - Breakdown 700V
Topology Flyback
Voltage - Start Up -
Voltage - Supply (Vcc/Vdd) -
Duty Cycle 70%
Frequency - Switching 83kHz
Power (Watts) 2.5 W
Fault Protection Current Limiting, Open Loop, Over Temperature, Short Circuit
Control Features -
Operating Temperature -40°C ~ 150°C (TJ)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154", 3.90mm Width), 7 Leads
Supplier Device Package SO-8C
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

LNK563DG - LinkSwitch-LP Offline Switcher IC

The LNK563DG from Power Integrations is a highly integrated offline AC-DC converter IC from the LinkSwitch-LP family, designed for low-power flyback applications up to 2.5W. This surface-mount switcher features a 700V breakdown voltage, 83kHz switching frequency, and comprehensive fault protection including current limiting, open loop detection, over-temperature shutdown, and short circuit protection.

Ideal for aerospace, automotive, industrial, and telecommunications applications requiring reliable, compact power conversion with minimal external components. The SO-8C package enables space-efficient PCB layouts while maintaining robust thermal performance across the full -40°C to 150°C junction temperature range.

Key Features:

  • Integrated 700V power MOSFET for flyback topology
  • 2.5W maximum output power with isolated output
  • 83kHz switching frequency with 70% duty cycle
  • Comprehensive protection: current limiting, open loop, over-temperature, short circuit
  • Wide operating temperature: -40°C to 150°C (TJ)
  • Compact SO-8C surface mount package
  • RoHS compliant

Applications: Standby power supplies, auxiliary power, smart home devices, IoT sensors, industrial controls, LED drivers, and low-power consumer electronics.

All units ship as authorized distributor stock with full manufacturer documentation, traceability, and long lifecycle support to mitigate obsolescence risk in critical designs.