NXP USA Inc. LPC2919FBD144/01/,

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NXP LPC2919FBD144/01 ARM9 Microcontroller - High-Performance Embedded Solution

The LPC2919FBD144/01 from NXP USA Inc. is a powerful 16/32-bit ARM9® microcontroller designed for demanding industrial and automotive applications. Operating at 80MHz with 768KB of flash memory and 80KB of RAM, this MCU delivers exceptional performance for complex embedded systems requiring robust connectivity and real-time processing capabilities.

Key Features & Benefits

  • High-Performance ARM9® Core: 16/32-bit architecture running at 80MHz for fast data processing
  • Generous Memory: 768KB flash program memory and 80KB RAM for complex applications
  • Extensive Connectivity: CANbus, LINbus, EBI/EMI, SPI, and UART/USART interfaces for versatile communication
  • Rich Peripheral Set: Includes POR, PWM, WDT, and 16-channel 10-bit A/D converter
  • 108 I/O Pins: Abundant GPIO for flexible system design
  • Industrial Temperature Range: Operates reliably from -40°C to 85°C
  • Low Voltage Operation: 1.71V to 3.6V supply voltage for power-efficient designs
  • Surface Mount Package: 144-LQFP (20x20mm) for automated assembly

Ideal Applications

This microcontroller is perfectly suited for automotive control systems, industrial automation, motor control, building automation, medical devices, and any application requiring robust real-time performance with multiple communication protocols.

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Product attributes Property Value
Manufacturer NXP USA Inc.
Product Series LPC2900
Packaging | Tray
Core Processor ARM9®
Core Size 16/32-Bit
Speed 80MHz
Connectivity CANbus, EBI/EMI, LINbus, SPI, UART/USART
Peripherals POR, PWM, WDT
Number of I/O 108
Program Memory Size 768KB (768K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 80K x 8
Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V
Data Converters A/D 16x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Grade -
Qualification -
Mounting Type Surface Mount
Supplier Device Package 144-LQFP (20x20)
Package / Case 144-LQFP