Microsemi Corporation M2S050S-1FG896I

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Regular price Dhs. 778.25
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1 Dhs. 778.25 Dhs. 778.25
15+ Dhs. 753.65 Dhs. 11,304.75
25+ Dhs. 737.27 Dhs. 18,431.75
50+ Dhs. 696.31 Dhs. 34,815.50
100+ Dhs. 614.39 Dhs. 61,439.00
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Microsemi M2S050S-1FG896I SmartFusion2 SoC FPGA

The M2S050S-1FG896I is a high-performance System-on-Chip (SoC) FPGA from Microsemi's SmartFusion2 family, combining an ARM Cortex-M3 microcontroller with 50,000 logic modules of programmable FPGA fabric. Designed for industrial, automotive, aerospace, and communications applications requiring reliable, long-lifecycle programmable logic solutions.

Key Features:

  • ARM Cortex-M3 processor core running at 166MHz
  • 50K logic module FPGA fabric for custom hardware acceleration
  • 256KB embedded Flash memory and 64KB RAM
  • Advanced peripherals: DDR controller, PCIe, SERDES
  • Rich connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Industrial temperature range: -40°C to 100°C (TJ)
  • 896-pin Fine-pitch Ball Grid Array (FBGA) package (31x31mm)

This device is ideal for embedded systems requiring both microcontroller functionality and FPGA flexibility, enabling designers to implement custom logic, DSP functions, and hardware acceleration alongside standard processor operations.

Product attributes Property Value
Manufacturer Microsemi Corporation
Product Series SmartFusion®2
Packaging Tray | Tray
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 256KB
RAM Size 64KB
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Speed 166MHz
Primary Attributes FPGA - 50K Logic Modules
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 896-BGA
Supplier Device Package 896-FBGA (31x31)