Microchip Technology M2S050TS-FGG896

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Microchip M2S050TS-FGG896 SmartFusion2 SoC FPGA

The M2S050TS-FGG896 from Microchip Technology is a high-performance SmartFusion®2 System-on-Chip (SoC) FPGA that combines an ARM® Cortex®-M3 microcontroller subsystem with 50,000 logic modules of FPGA fabric. This powerful integration delivers exceptional flexibility for embedded applications requiring both deterministic real-time processing and reconfigurable logic.

Key Features & Benefits

  • Dual Architecture: ARM Cortex-M3 MCU core running at 166MHz paired with 50K logic module FPGA fabric
  • Rich Connectivity: Integrated CANbus, Ethernet, I2C, SPI, UART/USART, and USB interfaces
  • High-Speed Peripherals: DDR memory controller, PCIe, and SERDES for demanding applications
  • Generous Memory: 256KB embedded Flash and 64KB RAM for program and data storage
  • Industrial Temperature Range: Operates reliably from 0°C to 85°C (junction temperature)
  • Fine-Pitch BGA Package: 896-FBGA (31x31mm) for high-density board designs
  • RoHS Compliant: Meets environmental standards for global distribution

Ideal Applications

Perfect for aerospace, automotive, industrial automation, medical devices, and telecommunications systems requiring secure, low-power processing with FPGA acceleration. The SmartFusion2 architecture enables design-in flexibility for motor control, sensor fusion, protocol bridging, and edge computing applications.

Design Support & Documentation

Full datasheets, reference designs, application notes, and development tools are available to accelerate your design-in process. Our technical team provides expert support for schematic review, BOM optimization, and lifecycle planning.

Quality & Traceability

All units ship with full traceability documentation and comply with RoHS/REACH regulations. Bulk packaging options available for production volumes. Contact us for lead times, pricing tiers, and custom tape-and-reel configurations.

Product attributes Property Value
Manufacturer Microchip Technology
Product Series SmartFusion®2
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 256KB
RAM Size 64KB
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Speed 166MHz
Primary Attributes FPGA - 50K Logic Modules
Operating Temperature 0°C ~ 85°C (TJ)
Grade -
Qualification -
Package / Case 896-BGA
Supplier Device Package 896-FBGA (31x31)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.