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M2S060-1FG676 SmartFusion®2 SoC FPGA - High-Performance Embedded Processing

The M2S060-1FG676 from Microchip Technology combines an ARM® Cortex®-M3 microcontroller with 60K logic module FPGA fabric, delivering exceptional flexibility for demanding embedded applications in aerospace, automotive, industrial control, medical devices, and telecommunications.

Key Features & Benefits

  • Dual-Architecture Design: ARM Cortex-M3 MCU + 60K logic module FPGA for maximum design flexibility
  • High-Speed Processing: 166MHz operation with 256KB Flash and 64KB RAM
  • Rich Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB interfaces
  • Advanced Peripherals: DDR, PCIe, and SERDES support for high-bandwidth applications
  • Industrial Temperature Range: 0°C to 85°C (TJ) for reliable operation in harsh environments
  • Compact 676-FBGA Package: 27x27mm footprint for space-constrained designs

Ideal Applications

Perfect for motor control, industrial automation, medical instrumentation, avionics systems, secure communications, and IoT edge computing where programmable logic and embedded processing must coexist.

Quality & Compliance

Active production status with full RoHS/REACH compliance. Authorized distribution ensures 100% traceability, genuine components, and comprehensive technical support including datasheets, reference designs, and design-in assistance.

Product attributes Property Value
Manufacturer Microchip Technology
Product Series SmartFusion®2
Packaging Tray |
Part Status Active
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 256KB
RAM Size 64KB
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Speed 166MHz
Primary Attributes FPGA - 60K Logic Modules
Operating Temperature 0°C ~ 85°C (TJ)
Grade -
Qualification -
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.