Microchip Technology M2S060TS-WAFERLOT
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 355,904.94 | Dhs. 355,904.94 |
| 15+ | Dhs. 344,665.84 | Dhs. 5,169,987.60 |
| 25+ | Dhs. 337,173.10 | Dhs. 8,429,327.50 |
| 50+ | Dhs. 318,441.26 | Dhs. 15,922,063.00 |
| 100+ | Dhs. 280,977.59 | Dhs. 28,097,759.00 |
| N+ | Dhs. 56,195.52 | Price Inquiry |
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Microchip M2S060TS-WAFERLOT SmartFusion2 FPGA System-on-Chip
The M2S060TS-WAFERLOT is a high-performance FPGA System-on-Chip from Microchip Technology's SmartFusion®2 family, combining an ARM® Cortex®-M3 microcontroller core with 60,000 logic modules of FPGA fabric. This wafer-level product delivers exceptional flexibility for industrial control, automotive systems, aerospace applications, and edge computing solutions.
Key Features & Benefits
- Dual Architecture: ARM Cortex-M3 MCU + 60K logic module FPGA for maximum design flexibility
- High-Speed Processing: 166MHz operation with 256KB Flash and 64KB RAM
- Advanced Connectivity: Integrated CANbus, Ethernet, I2C, SPI, UART/USART, and USB interfaces
- High-Performance Peripherals: DDR memory controller, PCIe, and SERDES for demanding applications
- Wafer-Level Supply: Bulk packaging for high-volume manufacturing and custom integration
Ideal Applications
Perfect for industrial automation, automotive control systems, aerospace instrumentation, communications infrastructure, and edge computing platforms requiring reconfigurable logic with embedded processing.
Note: This is a wafer-level product supplied in bulk for integration into custom assemblies and high-volume manufacturing applications.
| Product attributes | Property Value |
| Manufacturer | Microchip Technology |
| Product Series | SmartFusion®2 |
| Packaging | | Bulk |
| Architecture | MCU, FPGA |
| Core Processor | ARM® Cortex®-M3 |
| Flash Size | 256KB |
| RAM Size | 64KB |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Speed | 166MHz |
| Primary Attributes | FPGA - 60K Logic Modules |
| Operating Temperature | - |
| Grade | - |
| Qualification | - |
| Package / Case | Die |
| Supplier Device Package | Wafer |
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
