Microsemi Corporation M2S090S-1FG676I

Skip to product information
1 of 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Regular price Dhs. 916.73
Regular price Dhs. 964.98 Sale price Dhs. 916.73
Sale Sold out
Quantity Unit Price Total Price
1 Dhs. 916.73 Dhs. 916.73
15+ Dhs. 887.78 Dhs. 13,316.70
25+ Dhs. 868.48 Dhs. 21,712.00
50+ Dhs. 820.23 Dhs. 41,011.50
100+ Dhs. 723.74 Dhs. 72,374.00
N+ Dhs. 144.75 Price Inquiry
Shipping calculated at checkout.
Quantity
Component Recycling

Request Quote / Inquiry

Microsemi M2S090S-1FG676I SmartFusion2 SoC FPGA

The M2S090S-1FG676I is a high-performance System-on-Chip (SoC) FPGA from Microsemi's SmartFusion®2 family, combining an ARM® Cortex®-M3 microcontroller with 90,000 logic modules in a single device. Ideal for industrial, automotive, aerospace, and communications applications requiring programmable logic with embedded processing.

Key Features

  • Dual Architecture: ARM Cortex-M3 MCU + 90K logic module FPGA
  • High Performance: 166MHz processor speed with 512KB Flash and 64KB RAM
  • Advanced Connectivity: DDR, PCIe, SERDES, CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Industrial Grade: Operating temperature range -40°C to 100°C (TJ)
  • Compact Package: 676-FBGA (27x27mm) for space-constrained designs

Applications

Perfect for motor control, industrial automation, embedded vision systems, secure communications, and mixed-signal processing applications that demand both FPGA flexibility and microcontroller integration.

All specifications are from official Microsemi documentation. RoHS compliant. Authentic components with full traceability.

Product attributes Property Value
Manufacturer Microsemi Corporation
Product Series SmartFusion®2
Packaging Tray | Tray
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 512KB
RAM Size 64KB
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Speed 166MHz
Primary Attributes FPGA - 90K Logic Modules
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)