Microchip Technology M7AFS600-FG256

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Microchip M7AFS600-FG256 Fusion® FPGA

High-density FPGA solution from the Microchip Fusion® family, engineered for demanding aerospace, automotive, industrial, and telecommunications applications. This authentic M7AFS600-FG256 comes with complete manufacturer documentation and full traceability assurance.

Key Features

  • 600,000 gates for complex logic implementation
  • 119 I/O pins for extensive connectivity
  • 110,592 total RAM bits for data-intensive operations
  • Surface mount 256-LBGA/256-FPBGA (17x17) package
  • Operating temperature: 0°C to 70°C (TA)
  • Supply voltage: 1.425V to 1.575V

Applications

Ideal for high-reliability B2B integration in aerospace systems, automotive electronics, industrial control, and telecommunications infrastructure. Backed by authorized distributor stock and long lifecycle commitment.

Product attributes Property Value
Manufacturer Microchip Technology
Product Series Fusion®
Packaging Tray | Tray
Number of LABs/CLBs -
Number of Logic Elements/Cells -
Total RAM Bits 110592
Number of I/O 119
Number of Gates 600000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 70°C (TA)
Grade -
Qualification -
Package / Case 256-LBGA
Supplier Device Package 256-FPBGA (17x17)

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.