NXP USA Inc. MCIMX6L3DVN10AC

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NXP MCIMX6L3DVN10AC - High-Performance ARM Cortex-A9 Microprocessor

The MCIMX6L3DVN10AC from NXP USA Inc. is a powerful single-core ARM® Cortex®-A9 microprocessor designed for demanding industrial and embedded applications. Operating at 1.0GHz, this 32-bit MPU delivers exceptional performance for multimedia processing, human-machine interfaces, and connected IoT devices.

Key Features & Benefits

  • ARM Cortex-A9 Architecture: Industry-leading processing power with NEON™ SIMD co-processor for advanced multimedia capabilities
  • Graphics Acceleration: Built-in GPU support for rich user interfaces and display applications
  • Comprehensive Security: ARM TrustZone, secure boot, cryptography engine, tamper detection, and secure JTAG protect your embedded systems
  • Flexible Memory Support: Compatible with LPDDR2, LVDDR3, and DDR3 RAM controllers for scalable performance
  • Rich Connectivity: 10/100Mbps Ethernet, USB 2.0 + PHY (3 ports), I2C, SPI, UART, MMC/SD/SDIO, and more
  • Industrial Temperature Range: Operates reliably from 0°C to 95°C (TJ) for harsh environments
  • Compact 432-MAPBGA Package: Space-efficient 13x13mm surface mount design

Ideal Applications

Perfect for industrial HMI panels, portable medical devices, automotive infotainment systems, smart home controllers, and embedded Linux/Android platforms requiring robust multimedia processing and secure operation.


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Product attributes Property Value
Manufacturer NXP USA Inc.
Product Series i.MX6SL
Packaging Tray
Core Processor ARM® Cortex®-A9
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 1.0GHz
Co-Processors/DSP Multimedia; NEON™ SIMD
RAM Controllers LPDDR2, LVDDR3, DDR3
Graphics Acceleration Yes
Display & Interface Controllers Keypad, LCD
Ethernet 10/100Mbps (1)
SATA -
USB USB 2.0 + PHY (3)
Voltage - I/O 1.2V, 1.8V, 3.0V
Operating Temperature 0°C ~ 95°C (TJ)
Grade -
Qualification -
Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type Surface Mount
Package / Case 432-TFBGA
Supplier Device Package 432-MAPBGA (13x13)
Additional Interfaces AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
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