NXP USA Inc. MCIMX6X3CVN08AB

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About the MCIMX6X3CVN08AB Microprocessor

The MCIMX6X3CVN08AB from NXP USA Inc. is a high-performance application processor from the i.MX6SX series, designed for embedded and industrial applications requiring robust multimedia capabilities and advanced connectivity. This dual-core solution combines an ARM Cortex-A9 processor running at 800MHz with an ARM Cortex-M4 co-processor at 200MHz, delivering exceptional performance for demanding real-time applications.

Key Features & Benefits

Powerful Processing Architecture: The heterogeneous multi-core design enables efficient task distribution—the Cortex-A9 handles complex application workloads while the Cortex-M4 manages real-time control tasks, reducing system latency and power consumption.

Advanced Graphics & Display: Integrated graphics acceleration with NEON MPE (Media Processing Engine) supports rich user interfaces and multimedia applications, making it ideal for HMI (Human-Machine Interface) panels, industrial displays, and infotainment systems.

Comprehensive Connectivity: Dual Gigabit Ethernet (10/100/1000Mbps), multiple USB 2.0 interfaces with PHY, PCIe, CAN, and extensive serial interfaces (UART, SPI, I2C, I2S) provide flexible connectivity options for industrial automation, networking equipment, and IoT gateways.

Memory Flexibility: Supports LPDDR2, LVDDR3, and DDR3 memory controllers, allowing designers to optimize for performance, power consumption, or cost based on application requirements.

Industrial-Grade Reliability: Operating temperature range of -40°C to 105°C (TA) ensures reliable operation in harsh industrial environments, automotive applications, and outdoor installations.

Enhanced Security: Comprehensive security features including ARM TrustZone (TZ), Cryptographic Acceleration and Assurance Module (CAAM), Central Security Unit (CSU), High Assurance Boot (A-HAB), and Secure Non-Volatile Storage (SNVS) protect against unauthorized access and ensure secure boot processes.

Typical Applications

  • Industrial automation and control systems
  • Medical imaging and diagnostic equipment
  • Automotive infotainment and telematics
  • Smart home and building automation
  • Network attached storage (NAS) and routers
  • Point-of-sale (POS) terminals
  • Human-machine interface (HMI) panels
  • IoT gateways and edge computing devices

Package & Mounting

The 400-MAPBGA (17x17mm) package offers an excellent balance between pin count, thermal performance, and board space efficiency. Surface mount technology enables automated assembly and high-density PCB layouts.

Why Choose HQICKEY?

At HQICKEY, we specialize in authentic semiconductor sourcing with full lifecycle support. Every MCIMX6X3CVN08AB processor is sourced directly from authorized distributors, ensuring genuine NXP quality with full traceability and warranty protection. Our engineering-focused approach provides technical documentation, reference designs, and expert support to accelerate your development cycle.


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Product attributes Property Value
Manufacturer NXP USA Inc.
Product Series i.MX6SX
Packaging Tray |
Core Processor ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width 2 Core, 32-Bit
Speed 200MHz, 800MHz
Co-Processors/DSP Multimedia; NEON™ MPE
RAM Controllers LPDDR2, LVDDR3, DDR3
Graphics Acceleration Yes
Display & Interface Controllers Keypad, LCD
Ethernet 10/100/1000Mbps (2)
SATA -
USB USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage - I/O 1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature -40°C ~ 105°C (TA)
Grade -
Qualification -
Security Features A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type Surface Mount
Package / Case 400-LFBGA
Supplier Device Package 400-MAPBGA (17x17)
Additional Interfaces AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
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