NXP USA Inc. MIMX8MN3DVPIZAA

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NXP MIMX8MN3DVPIZAA - High-Performance i.MX8MN Application Processor

The MIMX8MN3DVPIZAA from NXP USA Inc. is a powerful application processor from the i.MX8MN series, featuring a heterogeneous multi-core architecture with ARM® Cortex®-A53 and ARM® Cortex®-M7 cores. Designed for advanced embedded applications, this processor delivers exceptional performance at 1.4GHz while maintaining energy efficiency.

Key Features & Benefits

  • Powerful Multi-Core Architecture: 3-core 64-bit design combining ARM Cortex-A53 application cores with Cortex-M7 real-time processing
  • Advanced Multimedia Capabilities: Integrated graphics acceleration with NEON™ MPE co-processor for enhanced multimedia performance
  • Flexible Memory Support: Compatible with DDR3L, DDR4, and LPDDR4 RAM controllers for versatile system design
  • Rich Connectivity: Gigabit Ethernet, USB 2.0 OTG with PHY, PCIe, and multiple serial interfaces (I2C, SPI, UART, I2S)
  • Display & Camera Interfaces: LCD and MIPI-CSI controllers for advanced display and imaging applications
  • Enterprise-Grade Security: Comprehensive security features including ARM TrustZone, CAAM, HAB, and SNVS
  • Industrial Temperature Range: Operates reliably from 0°C to 95°C (TJ) for demanding environments

Ideal Applications

Perfect for industrial IoT gateways, smart home hubs, medical devices, automotive infotainment systems, edge computing platforms, and advanced HMI applications requiring robust processing power and multimedia capabilities.

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Product attributes Property Value
Manufacturer NXP USA Inc.
Product Series i.MX8MN
Packaging Tray |
Core Processor ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width 3 Core, 64-Bit
Speed 1.4GHz
Co-Processors/DSP Multimedia; NEON™ MPE
RAM Controllers DDR3L, DDR4, LPDDR4
Graphics Acceleration Yes
Display & Interface Controllers LCD, MIPI-CSI
Ethernet GbE
SATA -
USB USB 2.0 OTG + PHY (1)
Voltage - I/O -
Operating Temperature 0°C ~ 95°C (TJ)
Grade -
Qualification -
Security Features ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Mounting Type Surface Mount
Package / Case 306-TFBGA
Supplier Device Package 306-TFBGA (11x11)
Additional Interfaces AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
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