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NXP USA Inc.

MPC8313EZQAFFC

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Recycling Electronic Components

NXP MPC8313EZQAFFC PowerPC Microprocessor - High-Performance Embedded Processing Solution

The MPC8313EZQAFFC from NXP USA Inc. is a powerful PowerPC e300c3 core microprocessor designed for demanding embedded applications in aerospace, automotive, industrial, medical, and telecommunications sectors. Operating at 333MHz with integrated security features (SEC 2.2), this processor delivers exceptional performance and reliability for mission-critical systems.

Key Features & Benefits:

  • PowerPC e300c3 32-bit core running at 333MHz for robust processing power
  • Dual 10/100/1000Mbps Gigabit Ethernet ports for high-speed networking
  • USB 2.0 + PHY interface for versatile connectivity
  • DDR and DDR2 memory controller support for flexible memory configurations
  • Integrated cryptography security engine (SEC 2.2) for data protection
  • 516-TEPBGA (27x27mm) surface mount package for space-efficient designs
  • Wide operating temperature range: 0°C to 105°C for industrial environments
  • Multiple I/O interfaces: DUART, HSSI, I2C, PCI, SPI
  • Multi-voltage I/O support: 1.8V, 2.5V, 3.3V

Ideal for embedded controllers, network appliances, industrial automation, medical devices, and telecommunications equipment requiring high reliability and performance.


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All products are sourced from authorized distributors and come with full manufacturer warranties. Contact our technical team for volume pricing, custom configurations, and application support.

Product attributes Property Value
Manufacturer NXP USA Inc.
Product Series MPC83xx
Packaging |
Core Processor PowerPC e300c3
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 333MHz
Co-Processors/DSP Security; SEC 2.2
RAM Controllers DDR, DDR2
Graphics Acceleration No
Display & Interface Controllers -
Ethernet 10/100/1000Mbps (2)
SATA -
USB USB 2.0 + PHY (1)
Voltage - I/O 1.8V, 2.5V, 3.3V
Operating Temperature 0°C ~ 105°C (TA)
Grade -
Qualification -
Security Features Cryptography
Mounting Type Surface Mount
Package / Case 516-BBGA Exposed Pad
Supplier Device Package 516-TEPBGA (27x27)
Additional Interfaces DUART, HSSI, I2C, PCI, SPI

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