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NXP USA Inc.

MPC8313ZQAFFC

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Product Overview

The MPC8313ZQAFFC is a high-performance microprocessor from NXP USA Inc.'s PowerQUICC II Pro series, engineered for demanding embedded system applications across aerospace, automotive, industrial, medical, and telecommunications sectors. This advanced IC MPU delivers exceptional reliability and performance in a compact 516-TEPBGA (27x27) surface mount package.

Key Features & Benefits

  • Industrial-Grade Reliability: Designed for mission-critical applications requiring consistent performance in harsh environments
  • Compact Form Factor: 516-BBGA Exposed Pad / 516-TEPBGA (27x27) package optimizes board space utilization
  • Surface Mount Technology: Enables efficient automated assembly and enhanced thermal performance
  • PowerQUICC II Pro Architecture: Proven platform for high-reliability embedded computing solutions
  • Versatile Integration: Suitable for complex embedded systems requiring robust processing capabilities

Applications

The MPC8313ZQAFFC microprocessor excels in:

  • Aerospace and defense embedded systems
  • Automotive control and infotainment platforms
  • Industrial automation and control systems
  • Medical device processing units
  • Telecommunications infrastructure equipment
  • High-reliability embedded computing applications

This microprocessor features surface mount technology with a 516-BBGA Exposed Pad configuration, providing excellent thermal dissipation and electrical performance. The 516-TEPBGA (27x27) package delivers a compact footprint while maintaining robust connectivity options for complex embedded system designs.

Why Choose HQICKEY?

At HQICKEY, we specialize in providing high-reliability semiconductor components for professional applications. Our extensive inventory of microprocessors, memory ICs, FPGAs, and controllers ensures you have access to the components you need for your critical projects. We understand the demanding requirements of aerospace, automotive, industrial, and medical applications, and we're committed to delivering quality components with reliable service.

Related Resources

Explore our complete range of Microprocessors for your embedded system needs. Visit our homepage to discover our full catalog of semiconductor solutions, or check out our blog for the latest industry insights and technical updates.

Product attributes Property Value
Manufacturer NXP USA Inc.
Product Series
Packaging |
Core Processor -
Number of Cores/Bus Width -
Speed -
Co-Processors/DSP -
RAM Controllers -
Graphics Acceleration -
Display & Interface Controllers -
Ethernet -
SATA -
USB -
Voltage - I/O -
Operating Temperature -
Grade -
Qualification -
Security Features -
Mounting Type Surface Mount
Package / Case 516-BBGA Exposed Pad
Supplier Device Package 516-TEPBGA (27x27)
Additional Interfaces -

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