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NXP USA Inc.

MPC860ENZQ50D4R2

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MPC860ENZQ50D4R2 - High-Performance Embedded Microprocessor

The MPC860ENZQ50D4R2 from NXP USA Inc. is a powerful 32-bit embedded microprocessor designed for demanding industrial, telecommunications, and control applications. Built on the proven MPC8xx architecture, this processor delivers reliable performance at 50MHz with integrated communications capabilities.

Key Features & Benefits

  • Robust Processing Power: 32-bit MPC8xx core running at 50MHz ensures efficient execution of embedded applications
  • Integrated Communications: Built-in Communications Processor Module (CPM) with quad 10Mbps Ethernet controllers for network connectivity
  • Flexible Memory Support: DRAM controller for versatile memory configurations
  • Rich Peripheral Set: I2C, IrDA, PCMCIA, SPI, TDM, and UART/USART interfaces for comprehensive system integration
  • Industrial-Grade Reliability: Operating temperature range of 0°C to 95°C (TA) for harsh environments
  • Compact Surface Mount Package: 357-PBGA (25x25mm) for space-efficient board designs

Ideal Applications

This microprocessor excels in telecommunications equipment, industrial automation controllers, embedded networking devices, and mission-critical control systems where reliability and integrated communications are essential.

Performance Advantages

The MPC860ENZQ50D4R2 combines processing efficiency with integrated networking capabilities, making it an ideal choice for embedded systems requiring both computational power and communication flexibility. The quad Ethernet controllers enable multi-port networking applications without external PHY chips, reducing overall system cost and complexity. The Communications Processor Module offloads protocol handling from the main CPU, ensuring consistent real-time performance even under heavy network loads.

Design Considerations

When integrating the MPC860ENZQ50D4R2 into your design, consider the 3.3V I/O voltage requirements and ensure proper power supply decoupling for stable operation. The 357-PBGA package requires careful PCB layout with appropriate thermal management for the 0°C to 95°C operating range. The integrated DRAM controller supports various memory configurations, allowing designers to optimize cost versus performance based on application requirements.

Why Choose HQICKEY?

At HQICKEY, we specialize in providing high-reliability semiconductor components for aerospace, automotive, industrial, medical, and telecommunications applications. Our extensive inventory and global distribution network ensure you get the components you need, when you need them. Every component is sourced from authorized distributors and undergoes rigorous quality verification to meet the demanding standards of mission-critical applications.

Quality Assurance & Support

All MPC860ENZQ50D4R2 units are factory-sealed and come with full traceability documentation. Our technical support team is available to assist with component selection, datasheet interpretation, and application guidance. We maintain strict ESD handling protocols and proper storage conditions to ensure component integrity from our warehouse to your production line.

Related Products & Resources

Explore our complete range of Microprocessors for industrial and embedded systems, featuring the latest NXP, Intel, AMD, and other leading manufacturers. Visit the HQICKEY homepage to discover our full catalog of semiconductor solutions including FPGAs, memory ICs, power management, and interface controllers. Check out our technical blog for the latest industry insights, application notes, design tips, and product updates to help you stay ahead in embedded system development.

Product attributes Property Value
Manufacturer NXP USA Inc.
Product Series MPC8xx
Packaging |
Core Processor MPC8xx
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 50MHz
Co-Processors/DSP Communications; CPM
RAM Controllers DRAM
Graphics Acceleration No
Display & Interface Controllers -
Ethernet 10Mbps (4)
SATA -
USB -
Voltage - I/O 3.3V
Operating Temperature 0°C ~ 95°C (TA)
Grade -
Qualification -
Security Features -
Mounting Type Surface Mount
Package / Case 357-BBGA
Supplier Device Package 357-PBGA (25x25)
Additional Interfaces I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

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