Microchip Technology MPF050T-1FCSG325I

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Microchip MPF050T-1FCSG325I PolarFire FPGA

The MPF050T-1FCSG325I is a high-performance PolarFire FPGA from Microchip Technology, engineered for demanding industrial, automotive, aerospace, communications, and edge computing applications. This advanced System-on-Chip (SoC) device delivers exceptional logic density with 48,000 LABs and 3.7 million logic elements, making it ideal for complex FPGA fabric-intensive designs.

Key Features & Benefits

  • Massive Logic Capacity: 48,000 LABs with 3,774,874 logic elements for complex processing tasks
  • Flexible I/O: 164 I/O pins for versatile connectivity and interfacing
  • Industrial-Grade Reliability: Operating temperature range of -40°C to 100°C (TJ) ensures performance in harsh environments
  • Compact BGA Package: 325-TFBGA (11x11mm) surface mount package optimizes board space
  • Precision Power: 0.97V to 1.08V supply voltage for efficient, stable operation
  • Quality Packaging: Tray packaging for secure handling and storage

Ideal Applications

Perfect for high-performance embedded systems, signal processing, communications infrastructure, industrial automation, aerospace/defense systems, and edge AI/ML acceleration where reliability, logic density, and thermal performance are critical.

Backed by Microchip Technology's reputation for quality and long product lifecycles, the MPF050T-1FCSG325I ensures your design remains supported and available for years to come.

Product attributes Property Value
Manufacturer Microchip Technology
Product Series
Packaging Tray | Tray
Number of LABs/CLBs 48000
Number of Logic Elements/Cells 3774874
Total RAM Bits -
Number of I/O 164
Number of Gates -
Voltage - Supply 0.97V ~ 1.08V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Grade -
Qualification -
Package / Case 325-TFBGA
Supplier Device Package 325-BGA (11x11)

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.