Texas Instruments MSP430F2111IDW
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | $2.45 | $2.45 |
| 15+ | $2.37 | $35.55 |
| 25+ | $2.32 | $58.00 |
| 50+ | $2.19 | $109.50 |
| 100+ | $1.94 | $194.00 |
| N+ | $0.39 | Price Inquiry |
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| Product attributes | Property Value |
| Manufacturer | Texas Instruments |
| Product Series | MSP430F2xx |
| Packaging | Marketplace | Bulk |
| Core Processor | MSP430 CPU16 |
| Core Size | 16-Bit |
| Speed | 16MHz |
| Connectivity | - |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT |
| Number of I/O | 16 |
| Program Memory Size | 2KB (2K x 8 + 256B) |
| Program Memory Type | FLASH |
| EEPROM Size | - |
| RAM Size | 128 x 8 |
| Voltage - Supply (Vcc/Vdd) | 1.8V ~ 3.6V |
| Data Converters | Slope A/D |
| Oscillator Type | Internal |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Grade | - |
| Qualification | - |
| Mounting Type | Surface Mount |
| Supplier Device Package | 20-SOIC |
| Package / Case | 20-SOIC (0.295", 7.50mm Width) |
| ROHS |
The MSP430F2111IDW from Texas Instruments is a 16-bit MCU with 2KB flash and 128B RAM, running at 16MHz. Housed in a 20-SOIC package, it offers 1.8V-3.6V operation with integrated BOR, POR, PWM, and WDT. This version is ideal for through-hole prototyping and industrial applications.
- SOIC package – easier for prototyping and rework.
- Ultra-low power – extends battery life in field devices.
- 16-bit architecture – better precision than 8-bit MCUs.
- Integrated safety features – reduces external components.
Industrial Process Control
Robust SOIC package withstands vibration in factory environments.
Test Equipment
PWM and WDT support precise timing in benchtop instruments.
Consumer Appliances
1.8V operation enables direct battery connection.
Automotive Interior
BOR prevents resets during cranking voltage dips.
IoT End Nodes
Low pin count simplifies routing in sensor nodes.
Educational Kits
Easy to solder and debug for learning embedded systems.
- Q: What is the difference from IPW version?
- A: Package is 20-SOIC (wider) instead of TSSOP.
- Q: What is the core speed?
- A: 16MHz with MSP430 CPU16.
- Q: What is the memory size?
- A: 2KB flash plus 256B boot area, 128B RAM.
- Q: Is it suitable for prototyping?
- A: Yes, SOIC is easier for manual soldering.
- Q: What is the difference from IPW version?
- A: Package is 20-SOIC (wider) instead of TSSOP.
- Q: What is the core speed?
- A: 16MHz with MSP430 CPU16.
- Q: What is the memory size?
- A: 2KB flash plus 256B boot area, 128B RAM.
- Q: Is it suitable for prototyping?
- A: Yes, SOIC is easier for manual soldering.

MSP430F2111IDW.pdf