Texas Instruments OMAPL137CZKBT3

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OMAPL137CZKBT3 - High-Performance ARM + DSP Microprocessor

The OMAPL137CZKBT3 from Texas Instruments is a powerful dual-core application processor combining an ARM926EJ-S RISC core with a C674x DSP core, delivering exceptional performance for embedded industrial applications requiring both real-time signal processing and general-purpose computing capabilities.

Key Features & Benefits

  • Dual-Core Architecture: ARM926EJ-S processor at 375MHz paired with C674x DSP for optimized parallel processing
  • Rich Connectivity: Integrated 10/100Mbps Ethernet, dual USB (1.1 + PHY and 2.0 + PHY), and comprehensive peripheral interfaces
  • Display Support: Built-in LCD controller for direct display integration in HMI and industrial control applications
  • Extended Temperature Range: -40°C to 125°C junction temperature rating for harsh industrial environments
  • Flexible Memory Support: SDRAM controller with multiple interface options including MMC/SD, SPI, UART, I2C, and HPI
  • Compact BGA Package: 256-ball BGA (17x17mm) for space-constrained designs

Ideal Applications

Perfect for industrial automation, motor control, medical instrumentation, portable data terminals, and embedded systems requiring both DSP signal processing and ARM control functionality in a single chip solution.

Why Choose HQICKEY?

HQICKEY guarantees 100% authentic components with full traceability, long lifecycle availability, and dedicated technical support for your embedded system designs. We specialize in serving OEMs and system integrators with production-scale requirements.

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Product attributes Property Value
Manufacturer Texas Instruments
Product Series OMAP-L1x
Packaging Tray |
Core Processor ARM926EJ-S
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 375MHz
Co-Processors/DSP Signal Processing; C674x, System Control; CP15
RAM Controllers SDRAM
Graphics Acceleration No
Display & Interface Controllers LCD
Ethernet 10/100Mbps (1)
SATA -
USB USB 1.1 + PHY (1), USB 2.0 + PHY (2)
Voltage - I/O 1.8V, 3.3V
Operating Temperature -40°C ~ 125°C (TJ)
Grade -
Qualification -
Security Features -
Mounting Type Surface Mount
Package / Case 256-BGA
Supplier Device Package 256-BGA (17x17)
Additional Interfaces HPI, I2C, McASP, MMC/SD, SPI, UART
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