Octavo Systems LLC OSD6254-1G-IPM

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Regular price Dhs. 104.03
Regular price Dhs. 109.50 Sale price Dhs. 104.03
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Quantity Unit Price Total Price
1 Dhs. 104.03 Dhs. 104.03
15+ Dhs. 100.74 Dhs. 1,511.10
25+ Dhs. 98.55 Dhs. 2,463.75
50+ Dhs. 93.08 Dhs. 4,654.00
100+ Dhs. 82.13 Dhs. 8,213.00
N+ Dhs. 16.43 Price Inquiry
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Product attributes Property Value
Manufacturer Octavo Systems LLC
Product Series
Packaging Tray
Architecture MPU
Core Processor ARM® Cortex®-A53, ARM® Cortex®-M4F
Flash Size -
RAM Size 1GB
Peripherals DDR, DMA, PWM
Connectivity CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART, USB
Speed -
Primary Attributes -
Operating Temperature -40°C ~ 85°C
Grade -
Qualification -
Package / Case 500-LFBGA
Supplier Device Package 500-LFBGA (9x14)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

OSD6254-1G-IPM System-in-Package Module

The OSD6254-1G-IPM from Octavo Systems is a high-performance System-in-Package (SiP) solution featuring dual ARM® Cortex®-A53 and ARM® Cortex®-M4F processor cores with 1GB integrated RAM. This industrial-grade module delivers exceptional processing power and connectivity in a compact 500-LFBGA package.

Key Features & Benefits

  • Dual-Core Processing: ARM® Cortex®-A53 for high-performance applications and ARM® Cortex®-M4F for real-time control
  • 1GB Integrated RAM: Ample memory for demanding embedded applications
  • Industrial Temperature Range: Operates reliably from -40°C to 85°C for harsh environments
  • Rich Connectivity: Ethernet, USB, PCIe, CANbus, I2C, SPI, UART, MMC/SD/SDIO, and I2S interfaces
  • Advanced Peripherals: DDR, DMA, and PWM support for flexible system design
  • Compact Form Factor: 500-LFBGA (9x14mm) package optimizes board space

Ideal Applications

Perfect for industrial automation, IoT gateways, medical devices, automotive systems, robotics, and embedded computing platforms requiring robust processing with extensive I/O capabilities.