Qualcomm QCC-743-1-MQFN40-TR-00-0

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Product attributes Property Value
Manufacturer Qualcomm
Product Series Qualcomm® QCC740
Packaging Tape & Reel (TR) |
Part Status Active
Architecture DSP, MCU
Core Processor RISC-V
Flash Size 128KB
RAM Size 484KB
Peripherals I2S, PWM
Connectivity CANbus, I2C, SDIO, SPI, UART/USART
Speed 325MHz
Primary Attributes -
Operating Temperature -40°C ~ 105°C
Grade -
Qualification -
Package / Case 40-VFQFN
Supplier Device Package 40-QFN (5x5)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

Qualcomm® QCC743 Tri-Radio System-on-Chip

The QCC-743-1-MQFN40-TR-00-0 is a high-performance Bluetooth audio system-on-chip from Qualcomm's QCC740 series, featuring a RISC-V core processor with DSP and MCU architecture. Designed for advanced wireless audio applications, this SoC delivers exceptional connectivity and processing power in a compact 40-pin QFN package.

Key Features & Benefits

  • High-Performance Processing: 325MHz RISC-V core with integrated DSP for superior audio processing
  • Generous Memory: 484KB RAM and 128KB Flash for complex audio algorithms and firmware
  • Comprehensive Connectivity: CANbus, I2C, SDIO, SPI, UART/USART interfaces plus I2S and PWM peripherals
  • Industrial-Grade Reliability: Wide operating temperature range (-40°C to 105°C) for demanding environments
  • Production-Ready Packaging: Tape & Reel format for automated assembly processes
  • Environmentally Compliant: RoHS certified for global market compliance

Ideal Applications

Perfect for wireless headphones, earbuds, hearing aids, smart speakers, automotive audio systems, and IoT audio devices requiring low-power, high-quality audio processing with multi-protocol wireless connectivity.

All specifications are guaranteed by the manufacturer. Full traceability and compliance documentation available upon request.