Qualcomm QCC-744-2-MQFN56-MT-00-0

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Regular price Dhs. 12.33
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Product attributes Property Value
Manufacturer Qualcomm
Product Series Qualcomm® QCC740
Packaging Tray |
Part Status Active
Architecture DSP, MCU
Core Processor RISC-V
Flash Size 128KB
RAM Size 484KB
Peripherals I2S, PWM
Connectivity CANbus, I2C, SDIO, SPI, UART/USART
Speed 325MHz
Primary Attributes -
Operating Temperature -40°C ~ 105°C
Grade -
Qualification -
Package / Case 56-VFQFN
Supplier Device Package 56-QFN (7x7)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

Qualcomm QCC-744-2-MQFN56-MT-00-0 Bluetooth System-on-Chip

The Qualcomm QCC740 series is an advanced tri-radio Bluetooth System-on-Chip (SoC) designed for high-performance wireless audio and connectivity applications. Featuring a powerful RISC-V core processor running at 325MHz, this SoC delivers exceptional processing power for demanding embedded applications in industrial, automotive, and consumer electronics.

Key Features

  • RISC-V Architecture: Modern, efficient core processor with DSP and MCU capabilities
  • Generous Memory: 484KB RAM and 128KB Flash for complex applications
  • Wide Operating Range: -40°C to 105°C for industrial-grade reliability
  • Rich Connectivity: CANbus, I2C, SDIO, SPI, UART/USART interfaces
  • Audio Peripherals: I2S and PWM for high-quality audio processing
  • Compact Package: 56-VFQFN (7x7mm) for space-constrained designs
  • RoHS Compliant: Environmentally friendly and regulation-ready

Applications

Perfect for wireless earbuds, headphones, hearing aids, automotive audio systems, IoT devices, and industrial wireless communication modules.

Availability: Active stock available for immediate shipment. Backed by full technical documentation and long-term supply commitment.