Qualcomm QCC-744-2-MQFN56-TR-00-0

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Product attributes Property Value
Manufacturer Qualcomm
Product Series Qualcomm® QCC740
Packaging Tape & Reel (TR) |
Part Status Active
Architecture DSP, MCU
Core Processor RISC-V
Flash Size 128KB
RAM Size 484KB
Peripherals I2S, PWM
Connectivity CANbus, I2C, SDIO, SPI, UART/USART
Speed 325MHz
Primary Attributes -
Operating Temperature -40°C ~ 105°C
Grade -
Qualification -
Package / Case 56-VFQFN
Supplier Device Package 56-QFN (7x7)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

Qualcomm QCC-744-2-MQFN56-TR-00-0 System-on-Chip

The Qualcomm QCC-744-2-MQFN56-TR-00-0 is a high-performance tri-radio System-on-Chip (SoC) from the Qualcomm® QCC740 product series. Featuring a RISC-V core processor with DSP and MCU architecture, this advanced SoC operates at 325MHz and is designed for demanding embedded applications requiring robust connectivity and processing power.

Key Features

  • RISC-V Core Processor: Modern, efficient architecture with DSP and MCU capabilities
  • High-Speed Performance: 325MHz operating frequency for responsive processing
  • Generous Memory: 484KB RAM and 128KB Flash for application flexibility
  • Comprehensive Connectivity: CANbus, I2C, SDIO, SPI, UART/USART interfaces
  • Audio Support: I2S and PWM peripherals for audio applications
  • Wide Operating Range: -40°C to 105°C for industrial and automotive applications
  • Compact Package: 56-VFQFN (7x7mm) for space-constrained designs
  • RoHS Compliant: Environmentally friendly, meets global standards

Applications

Ideal for wireless audio devices, IoT edge computing, industrial automation, automotive systems, and smart home applications requiring multi-protocol connectivity and real-time processing.

Ordering Information

Part Number: QCC-744-2-MQFN56-TR-00-0 | Packaging: Tape & Reel | Package Type: 56-QFN (7x7mm) | Status: Active