STMicroelectronics SPC574K72E7C6FAR

Skip to product information
1 of 1
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Regular price $63.19
Regular price $15.80 Sale price $63.19
Sale Sold out
Quantity Unit Price Total Price
1 $63.19 $63.19
15+ $14.54 $218.10
25+ $14.22 $355.50
50+ $13.43 $671.50
100+ $11.85 $1,185.00
N+ $2.37 Price Inquiry
Shipping calculated at checkout.
Quantity
Component Recycling

Request Quote / Inquiry

Product attributes Property Value
Manufacturer STMicroelectronics
Product Series MPC57xx
Packaging Tray | NULL
Core Processor e200z2, e200z4, e200z4
Core Size 32-Bit Tri-Core
Speed 80MHz/160MHz
Connectivity CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, UART/USART
Peripherals DMA, LVD, POR, Zipwire
Number of I/O -
Program Memory Size 2.5MB (2.5M x 8)
Program Memory Type FLASH
EEPROM Size 64K x 8
RAM Size 64K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Data Converters A/D 12b SAR, 16b Sigma-Delta
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Grade Automotive
Qualification AEC AEC-Q100
Mounting Type Surface Mount
Supplier Device Package 176-eLQFP (24x24)
Package / Case 176-LQFP Exposed Pad
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

The STMicroelectronics SPC574K72E7C6FAR is a high-reliability multi-core MCU for automotive and industrial safety applications. It combines an e200z2 core at 80MHz and two e200z4 cores at 160MHz, delivering 2.5MB flash and 64KB RAM. Operating from 3V to 5.5V, it includes DMA, LVD, POR, and Zipwire interfaces. The 176-LQFP exposed pad package ensures excellent thermal performance from -40°C to 125°C.

  • Multi-core redundancy: Three cores enable lockstep or independent execution for safety-critical functions.
  • High temperature tolerance: 125°C rating supports under-hood and industrial high-heat applications.
  • Large flash: 2.5MB accommodates complex AUTOSAR stacks and calibration data.
  • Enhanced thermal management: Exposed pad package improves heat transfer to PCB.

Advanced Driver Assistance Systems (ADAS)

The multi-core architecture (e200z2 + dual e200z4) provides redundant processing for sensor fusion and safety-critical algorithms.

Electric Vehicle Battery Management

With 2.5MB flash and Zipwire interface, it manages cell monitoring and balancing across multiple battery modules.

Engine Management Systems

The 160MHz cores handle real-time combustion control, while DMA and LVD ensure reliable operation under vibration and temperature extremes.

Chassis Control (ABS/ESC)

High-speed processing and POR/WDT features support fail-safe operation for anti-lock braking and stability control.

Industrial Robotics

The 125°C rating and exposed pad package allow deployment in high-heat factory environments without active cooling.

Railway Signaling Systems

Multi-core redundancy and wide voltage range (3-5.5V) meet safety integrity levels for train control applications.

Q: What is the architecture of the SPC574K72E7C6FAR?
A: It features a multi-core design with one e200z2 and two e200z4 cores, running at 80MHz/160MHz.
Q: How much flash memory is available?
A: It provides 2.5MB of program flash and 64KB of RAM.
Q: What is the operating temperature range?
A: It is rated for -40°C to 125°C, suitable for extreme automotive environments.
Q: What package does it use?
A: It comes in a 176-LQFP Exposed Pad package for improved thermal dissipation.
Base Product Number : SPC574K72E7C6FAR
160MHz 2.5MB Flash 32-bit MCU 64KB RAM 80MHz ADAS Automotive DMA e200z2 e200z4 Exposed Pad LQFP-176 LVD Multi-core POR Safety Zipwire
Q: What is the architecture of the SPC574K72E7C6FAR?
A: It features a multi-core design with one e200z2 and two e200z4 cores, running at 80MHz/160MHz.
Q: How much flash memory is available?
A: It provides 2.5MB of program flash and 64KB of RAM.
Q: What is the operating temperature range?
A: It is rated for -40°C to 125°C, suitable for extreme automotive environments.
Q: What package does it use?
A: It comes in a 176-LQFP Exposed Pad package for improved thermal dissipation.