Texas Instruments TDA2HVBDQABCRQ1
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 355,904.94 | Dhs. 355,904.94 |
| 15+ | Dhs. 344,665.84 | Dhs. 5,169,987.60 |
| 25+ | Dhs. 337,173.10 | Dhs. 8,429,327.50 |
| 50+ | Dhs. 318,441.26 | Dhs. 15,922,063.00 |
| 100+ | Dhs. 280,977.59 | Dhs. 28,097,759.00 |
| N+ | Dhs. 56,195.52 | Price Inquiry |
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Texas Instruments TDA2HVBDQABCRQ1 - High-Performance Automotive SoC Processor
The TDA2HVBDQABCRQ1 from Texas Instruments is a cutting-edge System-on-Chip (SoC) processor engineered for advanced automotive applications, including Advanced Driver Assistance Systems (ADAS), vision processing, and real-time automotive computing. This powerful heterogeneous processor combines ARM® Cortex®-A15 MPU, dual ARM® Cortex®-M4 cores, and a C66x DSP to deliver exceptional performance for safety-critical automotive environments.
Key Features & Benefits
- Heterogeneous Multi-Core Architecture: ARM Cortex-A15 for high-performance processing, dual Cortex-M4 for real-time control, and C66x DSP for intensive signal processing tasks
- High-Speed Operation: 500MHz clock speed ensures rapid data processing for time-sensitive automotive applications
- Robust Memory: 2.5MB integrated RAM for efficient data handling and buffering
- Comprehensive Connectivity: CANbus, Ethernet, USB, UART, SPI, I2C, MMC/SD/SDIO, and McASP interfaces for seamless integration into automotive systems
- Advanced Peripherals: DMA, PWM, WDT, and POR for flexible system design and enhanced reliability
- Automotive-Grade Reliability: Extended operating temperature range (-40°C to 125°C TJ) for harsh automotive environments
- Professional Packaging: 760-FCBGA (23x23mm) package optimized for space-constrained automotive designs
Ideal Applications
Perfect for automotive vision systems, surround-view cameras, ADAS platforms, sensor fusion, lane departure warning systems, collision avoidance, parking assistance, and next-generation automotive infotainment systems.
All specifications are subject to manufacturer updates. Please verify critical parameters with the latest datasheet.
| Product attributes | Property Value |
| Manufacturer | Texas Instruments |
| Product Series | |
| Packaging | | Tray |
| Architecture | DSP, MPU |
| Core Processor | ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x |
| Flash Size | - |
| RAM Size | 2.5MB |
| Peripherals | DMA, POR, PWM, WDT |
| Connectivity | CANbus, Ethernet, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB |
| Speed | 500MHz |
| Primary Attributes | - |
| Operating Temperature | -40°C ~ 125°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 760-BFBGA, FCBGA |
| Supplier Device Package | 760-FCBGA (23x23) |
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
