Renesas Electronics Corporation UPD70F3611M2GBA-GAH-QS-AX

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Product attributes Property Value
Manufacturer Renesas Electronics Corporation
Product Series V850ES/FE3-L
Packaging | Bulk
Core Processor V850ES
Core Size 32-Bit
Speed 20MHz
Connectivity CANbus, CSI, I2C, UART/USART
Peripherals LVD, POR, PWM, WDT
Number of I/O 51
Program Memory Size 96KB (96K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 6K x 8
Voltage - Supply (Vcc/Vdd) 3.3V ~ 5.5V
Data Converters A/D 10x10b SAR
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Grade -
Qualification -
Mounting Type Surface Mount
Supplier Device Package 64-LFQFP (10x10)
Package / Case 64-LQFP

Renesas UPD70F3611M2GBA-GAH-QS-AX - High-Performance 32-bit Microcontroller

The UPD70F3611M2GBA-GAH-QS-AX is a powerful 32-bit microcontroller from Renesas Electronics' V850ES/FE3-L series, designed for demanding automotive, industrial, and embedded control applications. Featuring a robust V850ES core running at 20MHz, this MCU delivers exceptional performance with integrated Flash memory and comprehensive peripheral support.

Key Features & Benefits

  • High-Performance Core: 32-bit V850ES processor operating at 20MHz for fast, efficient processing
  • Generous Memory: 96KB Flash program memory and 6KB RAM for complex applications
  • Rich Connectivity: CANbus, I2C, UART/USART, and CSI interfaces for versatile communication
  • Advanced Peripherals: Integrated PWM, WDT, LVD, and POR for robust system control
  • Precision Analog: 10-channel 10-bit SAR ADC for accurate sensor interfacing
  • Flexible I/O: 51 general-purpose I/O pins for extensive peripheral connectivity
  • Wide Operating Range: 3.3V to 5.5V supply voltage, -40°C to 85°C temperature range
  • Compact Package: 64-LQFP surface mount package (10x10mm) for space-efficient designs

Ideal Applications

This microcontroller excels in automotive body control modules, industrial automation systems, motor control applications, sensor networks, and embedded IoT devices requiring reliable real-time performance and robust communication capabilities.

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