Winbond Electronics W29N02KVBIAF TR

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Regular price Dhs. 13.26
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Product attributes Property Value
Manufacturer Winbond Electronics
Product Series
Packaging Tape & Reel (TR) |
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND (SLC)
Memory Size 2Gbit
Memory Organization 256M x 8
Memory Interface -
Clock Frequency -
Write Cycle Time - Word, Page 25ns
Access Time 20 ns
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 63-VFBGA
Supplier Device Package 63-VFBGA (9x11)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

Winbond W29N02KVBIAF TR - High-Performance 2Gbit NAND Flash Memory Solution

The W29N02KVBIAF TR from Winbond Electronics represents a premium 2Gbit SLC NAND Flash memory solution engineered for demanding industrial, automotive, medical, and telecommunications applications. This surface-mount device delivers exceptional reliability with a 256M x 8 memory organization in a compact 63-VFBGA package, ensuring long lifecycle availability and complete traceability for mission-critical design-in requirements.

Designed for extended temperature operation (-40°C to 85°C), this non-volatile flash memory provides fast 20ns access time and 25ns write cycle performance, making it ideal for aerospace-grade systems, industrial controllers, and high-reliability embedded applications requiring durable data retention.

Key Features & Benefits

  • High-Density Storage: 2Gbit capacity with 256M x 8 organization provides ample non-volatile storage for firmware, data logging, and embedded applications
  • SLC NAND Technology: Single-Level Cell architecture ensures superior endurance, data retention, and reliability compared to MLC alternatives
  • Extended Temperature Range: -40°C to 85°C operating range qualifies this component for harsh industrial and automotive environments
  • Fast Performance: 20ns access time and 25ns write cycle enable rapid data throughput for time-sensitive applications
  • Compact Footprint: 63-VFBGA (9x11mm) surface-mount package optimizes board space utilization
  • Wide Voltage Range: 2.7V to 3.6V supply voltage supports diverse system architectures and low-power designs
  • RoHS Compliant: Meets environmental compliance standards for global market deployment
  • Long Lifecycle Support: Winbond's commitment to extended product availability ensures design longevity and supply chain stability

Typical Applications

  • Aerospace & Defense Systems
  • Automotive Electronics & Infotainment
  • Industrial Automation & Control
  • Medical Devices & Diagnostic Equipment
  • Telecommunications Infrastructure
  • Embedded Computing Platforms
  • Data Acquisition Systems
  • Firmware Storage & Boot Code

Quality & Compliance

This component is sourced through authorized distribution channels, ensuring full traceability, authenticity verification, and compliance with RoHS/REACH environmental directives. All units are supplied in tape and reel packaging suitable for automated SMT assembly processes.

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