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Winbond Electronics

Winbond W632GG6NB09I - 2Gbit DDR3 SDRAM Memory IC 128M x 16 96-VFBGA

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Winbond W632GG6NB09I - High-Performance 2Gbit DDR3 SDRAM Memory IC

The Winbond W632GG6NB09I is a 2-gigabit DDR3 SDRAM memory integrated circuit engineered for demanding embedded applications requiring reliable, high-speed volatile memory. With a 128M x 16 organization and 1.067 GHz clock frequency, this industrial-grade memory IC delivers exceptional performance for automotive, telecommunications, industrial automation, and mission-critical embedded systems.

Key Features & Technical Highlights

  • High-Density Storage: 2Gbit (256MB) capacity in a compact 96-VFBGA surface-mount package (7.5x13mm footprint)
  • Fast Access Performance: 20ns access time and 15ns write cycle time ensure responsive system performance for real-time applications
  • Industrial Temperature Range: Operates reliably from -40°C to 95°C (TC), ideal for harsh environments and extended temperature applications
  • Low Power Operation: 1.425V to 1.575V supply voltage optimizes energy efficiency for battery-powered and embedded designs
  • RoHS Compliant: Lead-free, environmentally friendly manufacturing meets global regulatory standards (EU RoHS, REACH)
  • Standard DDR3 Interface: Industry-standard parallel DDR3 SDRAM interface ensures broad compatibility with processors and controllers
  • Long Lifecycle Support: Winbond provides extended product availability and traceability for industrial and automotive applications

Ideal Applications for OEMs & Design Engineers

This memory IC is specifically engineered for:

  • Embedded Computing: Single-board computers (SBCs), industrial PCs, and edge computing platforms
  • Industrial Automation: PLCs, HMIs, motion controllers, and factory automation equipment
  • Automotive Systems: Infotainment systems, ADAS (Advanced Driver Assistance Systems), instrument clusters, and telematics
  • Telecommunications Infrastructure: Base stations, routers, switches, and network equipment
  • Medical Devices: Diagnostic equipment, patient monitoring systems, and imaging devices requiring long lifecycle support
  • Consumer Electronics: Set-top boxes, smart home devices, and IoT gateways with extended operating temperature requirements

Why Choose Winbond W632GG6NB09I?

Winbond Electronics is a globally recognized leader in memory solutions, offering proven reliability, comprehensive technical documentation, and long-term product availability. The W632GG6NB09I combines industry-standard DDR3 SDRAM technology with industrial-grade specifications, ensuring your designs meet stringent performance, quality, and traceability requirements for aerospace, automotive, industrial, and medical applications.

Technical Documentation: Download W632GG6NB09I Datasheet (PDF)

All specifications are subject to manufacturer updates. Please refer to the official datasheet for the most current information. We provide full traceability and authenticity documentation for all semiconductor components.

Ordering Information & Support

Stock availability, volume pricing, and lead times available upon request. We offer:

  • Authorized distribution with full manufacturer traceability
  • Technical support and design-in assistance
  • Custom packaging and kitting services
  • Global shipping with compliance documentation (RoHS, REACH, conflict minerals)
Product attributes Property Value
Manufacturer Winbond Electronics
Product Series
Packaging Tray | Tray
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - DDR3
Memory Size 2Gbit
Memory Organization 128M x 16
Memory Interface Parallel
Clock Frequency 1.067 GHz
Write Cycle Time - Word, Page 15ns
Access Time 20 ns
Voltage - Supply 1.425V ~ 1.575V
Operating Temperature -40°C ~ 95°C (TC)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 96-VFBGA
Supplier Device Package 96-VFBGA (7.5x13)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

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