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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
W632GU6QB09I
| Quantity | Unit Price | Total Price |
|---|---|---|
| 1 | Dhs. 13.49 AED | Dhs. 13.49 AED |
| 15+ | Dhs. 13.06 AED | Dhs. 195.90 AED |
| 25+ | Dhs. 12.78 AED | Dhs. 319.50 AED |
| 50+ | Dhs. 12.07 AED | Dhs. 603.50 AED |
| 100+ | Dhs. 10.65 AED | Dhs. 1,065.00 AED |
| N+ | Dhs. 2.13 AED | Price Inquiry |
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Winbond W632GU6QB09I - High-Performance 2Gbit DDR3L SDRAM Memory IC
The Winbond W632GU6QB09I is a high-reliability 2Gbit DDR3L SDRAM memory integrated circuit designed for demanding applications in aerospace, automotive, industrial, medical, and telecommunications sectors. This surface-mount memory IC delivers exceptional performance with a 1.067 GHz clock frequency and low-voltage operation (1.283V ~ 1.45V), making it ideal for power-sensitive embedded systems requiring long lifecycle availability and complete traceability.
Key Features & Benefits
- High-Density Memory: 2Gbit capacity with 128M x 16 organization provides ample storage for complex applications and data-intensive processing
- Fast Performance: 1.067 GHz clock frequency with 20ns access time ensures rapid data retrieval and seamless system operation
- Low Power Consumption: DDR3L technology with 1.283V ~ 1.45V supply voltage reduces energy usage by up to 15% compared to standard DDR3, ideal for battery-powered and thermally-constrained designs
- Extended Temperature Range: -40°C to 95°C (TC) operation for harsh industrial environments and mission-critical applications
- Compact Package: 96-VFBGA (7.5x13mm) surface mount design saves valuable board space while maintaining excellent thermal performance
- RoHS Compliant: Environmentally friendly, meeting international standards for hazardous substance restrictions
- Parallel Interface: Standard SDRAM interface for easy integration with existing system architectures
- Long Lifecycle Support: Backed by Winbond's commitment to extended product availability for industrial and embedded applications
Applications & Use Cases
This memory IC is engineered for mission-critical systems requiring long lifecycle availability, full traceability, and proven reliability:
- Aerospace: Avionics systems, flight control computers, navigation equipment, and satellite communications
- Automotive: Advanced driver assistance systems (ADAS), infotainment platforms, instrument clusters, and autonomous driving modules
- Industrial Automation: Programmable logic controllers (PLCs), robotics, machine vision systems, and process control equipment
- Medical Devices: Diagnostic imaging equipment, patient monitoring systems, laboratory analyzers, and surgical instruments
- Telecommunications: Base stations, network routers, switching equipment, and wireless infrastructure
- Embedded Computing: Single-board computers, industrial PCs, edge computing devices, and IoT gateways
Why Choose HQICKEY for Your Memory Components?
As an authorized distributor of Winbond Electronics, HQICKEY provides authentic components with complete traceability documentation and compliance certifications (RoHS/REACH) for every order. Our commitment to quality ensures you receive genuine parts sourced directly from the manufacturer, backed by comprehensive technical support and engineering expertise.
Quality Assurance & Compliance
- 100% authentic components sourced directly from Winbond Electronics
- Full traceability documentation with lot codes and date codes
- RoHS and REACH compliance certificates included with every shipment
- Moisture sensitivity level (MSL) handling and storage guidelines provided
- Anti-counterfeit measures and quality inspection protocols
Design Support & Technical Resources
Accelerate your design-in process with comprehensive technical resources including detailed datasheets, reference designs, application notes, and layout guidelines. Our experienced engineering team is available to support your integration requirements, answer technical questions, and provide design recommendations for optimal performance.
Ordering Information
Available in tray packaging for volume production requirements. Contact our sales team for pricing on larger quantities, custom packaging options, and scheduled delivery programs to support your manufacturing timeline.
Related Resources & Product Categories
Explore our comprehensive range of memory solutions and stay updated with the latest industry insights:
- Browse our complete Memory Components catalog - Discover high-performance DRAM, DDR3L, DDR4, SDRAM, Flash, and specialty memory ICs from leading manufacturers including Winbond, Micron, Samsung, and SK Hynix for aerospace, automotive, industrial, medical, and telecommunications applications.
- Visit HQICKEY Homepage - Your trusted source for authentic semiconductor components with full traceability, compliance documentation, competitive pricing, and dedicated engineering support for mission-critical systems and long-lifecycle embedded applications.
- Read our Technical Blog - Stay informed with the latest semiconductor industry news, product announcements, design tips, application notes, and technical resources to accelerate your development process and optimize system performance.
| Product attributes | Property Value |
| Manufacturer | Winbond Electronics |
| Product Series | |
| Packaging | Tray | |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - DDR3L |
| Memory Size | 2Gbit |
| Memory Organization | 128M x 16 |
| Memory Interface | Parallel |
| Clock Frequency | 1.067 GHz |
| Write Cycle Time - Word, Page | 15ns |
| Access Time | 20 ns |
| Voltage - Supply | 1.283V ~ 1.45V |
| Operating Temperature | -40°C ~ 95°C (TC) |
| Grade | - |
| Qualification | - |
| Mounting Type | Surface Mount |
| Package / Case | 96-VFBGA |
| Supplier Device Package | 96-VFBGA (7.5x13) |
| ROHS |  |
No datasheet available. Please contact sales@hqickey.com for the latest datasheet.
