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Winbond Electronics

W632GU8QB-09

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Recycling Electronic Components

Winbond W632GU8QB-09 - High-Performance DDR3L SDRAM Memory IC

The W632GU8QB-09 from Winbond Electronics is a high-performance 2Gbit DDR3L SDRAM memory integrated circuit designed for demanding applications in aerospace, automotive, industrial, medical, and telecommunications sectors. This volatile memory solution delivers exceptional reliability and performance in a compact 78-VFBGA surface mount package.

Key Features & Benefits

  • High-Density Memory: 2Gbit capacity with 256M x 8 organization provides ample storage for embedded systems
  • Fast Performance: 1.067 GHz clock frequency with 20ns access time ensures rapid data retrieval
  • Low Power Consumption: DDR3L technology operates at 1.283V ~ 1.45V, reducing energy requirements
  • Wide Temperature Range: Operates reliably from 0°C to 95°C (TC), suitable for harsh environments
  • Industry-Standard Interface: Parallel memory interface for seamless integration
  • Compact Footprint: 78-VFBGA (8x10.5) package optimizes board space
  • RoHS Compliant: Environmentally friendly manufacturing meets global standards

Applications

The W632GU8QB-09 is ideal for mission-critical embedded systems requiring high-reliability memory solutions:

  • Aerospace avionics and flight control systems
  • Automotive infotainment and ADAS (Advanced Driver Assistance Systems)
  • Industrial automation and control equipment
  • Medical diagnostic and imaging devices
  • Telecommunications infrastructure and networking equipment
  • High-performance computing and data processing

Why Choose HQICKEY for Your Memory Components?

At HQICKEY, we specialize in providing high-quality semiconductor components for demanding applications. Our extensive catalog includes a wide range of memory solutions, microcontrollers, FPGAs, and other critical components for embedded systems.

Explore More Memory Solutions: Browse our complete Memory Collection to find the perfect memory IC for your next project, including DRAM, SRAM, Flash, and EEPROM solutions from leading manufacturers.

Stay Informed: Visit our News & Technical Blog for the latest semiconductor industry updates, technical insights, application notes, and product announcements.

For technical support, volume pricing, or custom solutions, contact our experienced team today.

Product attributes Property Value
Manufacturer Winbond Electronics
Product Series
Packaging Tray |
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - DDR3L
Memory Size 2Gbit
Memory Organization 256M x 8
Memory Interface Parallel
Clock Frequency 1.067 GHz
Write Cycle Time - Word, Page 15ns
Access Time 20 ns
Voltage - Supply 1.283V ~ 1.45V
Operating Temperature 0°C ~ 95°C (TC)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 78-VFBGA
Supplier Device Package 78-VFBGA (8x10.5)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.

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