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Product attributes Property Value
Manufacturer Winbond Electronics
Product Series
Packaging Tray |
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR3
Memory Size 1Gbit
Memory Organization 64M x 16
Memory Interface HSUL_12
Clock Frequency 933 MHz
Write Cycle Time - Word, Page 15ns
Access Time 5.5 ns
Voltage - Supply 1.14V ~ 1.3V, 1.7V ~ 1.95V
Operating Temperature -40°C ~ 85°C (TC)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 178-VFBGA
Supplier Device Package 178-VFBGA (11x11.5)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

Winbond W63AH6NBVACI - 1Gbit Mobile LPDDR3 SDRAM Memory IC

The W63AH6NBVACI from Winbond Electronics is a high-performance 1Gbit Mobile LPDDR3 SDRAM designed for demanding mobile and embedded applications. Featuring a 64M x 16 memory organization and operating at 933MHz, this memory IC delivers exceptional speed and reliability for smartphones, tablets, automotive systems, and industrial equipment.

Key Features & Benefits

  • High-Speed Performance: 933MHz clock frequency with 5.5ns access time ensures rapid data processing
  • Low Power Consumption: LPDDR3 technology optimized for mobile and battery-powered devices
  • Industrial Temperature Range: Operates reliably from -40°C to 85°C (TC) for harsh environments
  • Compact Form Factor: 178-VFBGA (11x11.5mm) surface mount package saves valuable board space
  • RoHS Compliant: Environmentally friendly and meets global regulatory standards
  • Dual Voltage Operation: 1.14V ~ 1.3V and 1.7V ~ 1.95V supply voltage flexibility

Typical Applications

  • Smartphones and mobile devices
  • Tablets and portable computing
  • Automotive infotainment and ADAS systems
  • Industrial control and IoT devices
  • Embedded systems requiring high-speed, low-power memory

Why Choose Winbond W63AH6NBVACI?

Winbond Electronics is a trusted leader in semiconductor memory solutions, delivering components with proven reliability and full traceability. The W63AH6NBVACI combines cutting-edge LPDDR3 technology with industrial-grade specifications, making it the ideal choice for engineers designing next-generation mobile and embedded systems that demand both performance and power efficiency.

Quality & Compliance

All Winbond W63AH6NBVACI components are sourced through authorized distribution channels, ensuring 100% authenticity, full traceability, and compliance with RoHS/REACH environmental standards. Each unit is backed by comprehensive datasheets and technical support for seamless design integration.

Design Resources & Support

Access complete technical documentation, reference designs, and application notes to accelerate your product development. Our engineering team is available to provide design-in support and answer technical questions about integrating the W63AH6NBVACI into your application.