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Winbond Electronics

W668GG6TB06J

Regular price Dhs. 41.81
Regular price Dhs. 44.02 Sale price Dhs. 41.81
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Recycling Electronic Components

Winbond W668GG6TB06J - High-Density DDR4 Memory Solution

The W668GG6TB06J from Winbond Electronics is a premium 8GB DDR4-3200 memory IC engineered for demanding aerospace, automotive, industrial, and telecommunications applications. This industrial-grade component features an X16 interface and operates reliably across an extended temperature range of -40°C to 105°C, making it ideal for mission-critical systems requiring long-term availability and proven performance.

Key Features & Benefits:

  • High-Density 8GB Capacity: DDR4-3200 technology delivers exceptional bandwidth for data-intensive applications
  • Industrial Temperature Range: Operates from -40°C to 105°C for extreme environment reliability
  • X16 Interface: Optimized data path for high-performance system integration
  • Authentic Sourcing: Authorized distributor stock with full manufacturer documentation and traceability
  • Long Lifecycle Commitment: Designed for applications requiring extended product availability
  • RoHS Compliant: Meets environmental standards for global deployment

Applications:

This memory IC is specifically designed for B2B integration in aerospace navigation systems, automotive ADAS platforms, industrial automation controllers, telecommunications infrastructure, and other high-reliability applications where performance, traceability, and long-term support are essential.

All specifications subject to manufacturer documentation. Contact us for detailed datasheets, reference designs, and application notes to support your design-in process.

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Manufacturer Winbond Electronics
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Packaging Tray | Tray
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ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.

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