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Winbond Electronics

W66AP6NBUAFJ

Regular price Dhs. 12.47
Regular price Dhs. 13.11 Sale price Dhs. 12.47
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Recycling Electronic Components

Winbond W66AP6NBUAFJ - High-Performance Mobile LPDDR4 SDRAM

The W66AP6NBUAFJ from Winbond Electronics is a premium 1Gbit mobile LPDDR4 SDRAM designed for mission-critical applications requiring high-speed data access and exceptional reliability. This advanced memory IC delivers 1.6GHz clock frequency with ultra-fast 3.6ns access time, making it ideal for aerospace, automotive, industrial, and telecommunications systems.

Key Features & Benefits

  • High-Speed Performance: 1.6GHz clock frequency with 3.6ns access time ensures rapid data processing
  • Optimized Memory Architecture: 64M x 16 organization (1Gbit total capacity) for efficient data management
  • Extended Temperature Range: -40°C to 105°C (TC) operation for harsh environments
  • Low Power Consumption: Dual voltage supply (1.06V-1.17V, 1.7V-1.95V) optimizes energy efficiency
  • Compact Surface Mount Package: 200-WFBGA (10x14.5mm) for space-constrained designs
  • RoHS Compliant: Environmentally friendly and meets global regulatory standards

Applications

The W66AP6NBUAFJ is engineered for demanding applications including:

  • Aerospace and defense systems
  • Automotive infotainment and ADAS
  • Industrial automation and control
  • Medical diagnostic equipment
  • High-reliability telecommunications infrastructure
  • Mobile computing and embedded systems

Why Choose HQICKEY?

As an authorized distributor, HQICKEY guarantees 100% authentic Winbond components with full traceability and manufacturer support. We specialize in high-reliability semiconductors for mission-critical applications, offering rapid fulfillment, technical expertise, and comprehensive documentation to support your engineering teams.

Related Products & Resources

Explore our complete range of memory semiconductor solutions including DRAM, SRAM, Flash, and EEPROM from leading manufacturers. Visit our homepage to discover our full catalog of microcontrollers, FPGAs, analog ICs, and power management solutions. Stay updated with the latest industry insights and product announcements on our technical blog.

Need technical support or volume pricing? Contact our engineering team for datasheets, application notes, and custom procurement solutions.

Product attributes Property Value
Manufacturer Winbond Electronics
Product Series
Packaging Tray |
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR4
Memory Size 1Gbit
Memory Organization 64M x 16
Memory Interface LVSTL_11
Clock Frequency 1.6 GHz
Write Cycle Time - Word, Page 18ns
Access Time 3.6 ns
Voltage - Supply 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature -40°C ~ 105°C (TC)
Grade -
Qualification -
Mounting Type Surface Mount
Package / Case 200-WFBGA
Supplier Device Package 200-WFBGA (10x14.5)
ROHS RoHS Compliant - Hazardous Substance Free Electronic Components | HQICKEY

No datasheet available. Please contact sales@hqickey.com for the latest datasheet.

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